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Analog mixed-signal (AMS) circuit architecture has evolved towards more digital friendly due to technology scaling and demand for higher flexibility/reconfigurability. Meanwhile, the design complexity and cost of AMS circuits has…
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substrates are used to implement the inter-chiplet…
There are increasing number of works addressing the design challenges of fast, scalable solutions for the growing number of new type of applications. Recently, many of the solutions aimed at improving processing element capabilities to…
Signal processing is a fundamental component of almost any sensor-enabled system, with a wide range of applications across different scientific disciplines. Time series data, images, and video sequences comprise representative forms of…
Additive manufacturing (AM) technologies have undergone significant advancements through the integration of cooperative robotics additive manufacturing (C-RAM) platforms. By deploying AM processes on the end effectors of multiple robotic…
To support the development of internet-of-things applications, an enormous population of low-power devices are expected to be incorporated in wireless networks performing sensing and communication tasks. As a key technology for improving…
Shrinking transistors, which powered the advancement of computing in the past half century, has stalled due to power wall; now extreme heterogeneity is promised to be the next driving force to feed the needs of ever-increasingly diverse…
The dependency on the correct functioning of embedded systems is rapidly growing, mainly due to their wide range of applications, such as micro-grids, automotive device control, health care, surveillance, mobile devices, and consumer…
Resource-constrained embedded and mobile devices are becoming increasingly common. Since few years, some mobile and ubiquitous devices such as wireless sensor, able to be aware of their physical environment, appeared. Such devices enable…
The number and arrangement of sensors on mobile robot dramatically influence its perception capabilities. Ensuring that sensors are mounted in a manner that enables accurate detection, localization, and mapping is essential for the success…
This paper proposes a wearable-controlled mobile manipulator system for intelligent smart home assistance, integrating MEMS capacitive microphones, IMU sensors, vibration motors, and pressure feedback to enhance human-robot interaction. The…
To incorporate the computation and communication with the physical world, next generation architecture i.e. CPS is viewed as a new technology. To improve the better interaction with the physical world or to perk up the electricity delivery…
High-granularity calorimeters utilizing silicon pad sensors as main active material are being designed for the CMS endcap calorimeter upgrade and have been proposed for the electromagnetic calorimeters at CLIC, ILC and FCC-ee. The silicon…
The high integration density of MAPS, with silicon sensor and readout electronics implemented in the same device, allows very thin structures with a greatly reduced material budget. Thicknesses of $\mathcal{O}$(50~$\mu$m), values at which…
The design of communication signal sets is fundamentally a sphere packing problem. It aims to identify a set of M points in an N -dimensional space, with the objective of maximizing the separability of points that represent different…
Designing software compatible with cloud-based Microservice Architectures (MSAs) is vital due to the performance, scalability, and availability limitations. As the complexity of a system increases, it is subject to deprecation, difficulties…
During the ATLAS phase II upgrade, the tracking system of the ATLAS experiment will be replaced by an all-silicon detector called the inner tracker (ITK) with a pixel detector as the most inner part. The monitoring data of the new system…
As photonic technologies continue to grow in multidimensional aspects, integrated photonics holds a unique position and continuously presents enormous possibilities to research communities. Applications span across data centers,…
This chapter describes the basic design, simulation, and fabrication for fully Si integrated, waveguide coupled, optomechanical force and displacement sensors. The approach of full Si integration of all stationary nanophotonic components…
We investigate the microscopic contact of a cell/semiconductor hybrid. The semiconductor is nanostructured with the aim of single channel recording of ion channels in cell membranes. This approach will overcome many limitations of the…