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Traffic intersections are the most suitable locations for the deployment of computing, communications, and intelligence services for smart cities of the future. The abundance of data to be collected and processed, in combination with…
Silicon-based integrated photonics has demonstrated significant advances in miniaturization and performance, yet critical challenges remain in achieving efficient on-chip communication at high bandwidths. Plasmonic devices on silicon and…
Interface circuits are the key components that enable the hybrid integration of superconductor and semiconductor digital electronics. The design requirements of superconductor-semiconductor interface circuits vary depending on the…
Efficient operation of a submillimeter interferometer requires remote (preferably automated) control of mechanically tuned local oscillators, phase-lock loops, mixers, optics, calibration vanes and cryostats. The present control system for…
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…
Integrated sensing and communication (ISAC) is a key feature of next-generation wireless networks, enabling a wide range of emerging applications such as vehicle-to-everything (V2X) and unmanned aerial vehicles (UAVs), which operate in…
Integrated sensing, computation, and communication (ISCC) has been recently considered as a promising technique for beyond 5G systems. In ISCC systems, the competition for communication and computation resources between sensing tasks for…
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture…
In the construction of High-Luminosity Large Hadron Collider (HL-LHC) and Future Circular Collider (FCC) experiments, 3D pixel sensors have become indispensable components due to their superior radiation hardness, fast response, and low…
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer…
The growing demand for efficient, high-performance processing in machine learning (ML) and image processing has made hardware accelerators, such as GPUs and Data Streaming Accelerators (DSAs), increasingly essential. These accelerators…
The advent of modern, high-speed electron detectors has made the collection of multidimensional hyperspectral transmission electron microscopy datasets, such as 4D-STEM, a routine. However, many microscopists find such experiments daunting…
The combinatorics of track seeding has long been a computational bottleneck for triggering and offline computing in High Energy Physics (HEP), and remains so for the HL-LHC. Next-generation pixel sensors will be sufficiently fine-grained to…
MCSM is a recently proposed novel system concept to solve the massive access problem envisioned in future communication systems like 5G and industry 4.0 systems. This work focuses on the practical verification of the theoretical gains that…
The rapid evolution of Cyber-Physical Systems (CPS) across various domains like mobility systems, networked control systems, sustainable manufacturing, smart power grids, and the Internet of Things necessitates innovative solutions that…
Clustering is a very popular network structuring technique which mainly addresses the issue of scalability in large scale Wireless Sensor Networks. Additionally, it has been shown to improve the energy efficiency and prolong the life of the…
Data center interconnects (DCIs) will have to support throughputs of 400 Gbps or more per wavelength in the near future. To achieve such high data rates, coherent modulation and detection is used, which conventionally requires high-speed…
Reconfigurable intelligent surfaces (RISs) are key enablers for integrated sensing and communication (ISAC) systems in the 6G communication era. With the capability of dynamically shaping the channel, RISs can enhance communication…
Internet of Things (IoT) will create a cyberphysical world where all the things around us are connected to the Inter net, sense and produce "big data" that has to be stored, processed and communicated with minimum human intervention. With…
Major challenges of micro thermal machines are the thermal insulation and mechanical tolerance in the case of sliding piston. Switching from piston to membrane in microengines can alleviate the latest and lead to planar architectures.…