Related papers: Interconnect Challenges in Highly Integrated MEMS/…
The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs…
The smart integrated systems of tomorrow would demand a combination of micromechanical components and traditional electronics. On-chip solutions will be the ultimate goal. One way of making such systems is to implement the mechanical parts…
Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation…
The exciting field of stretchable electronics (SE) promises numerous novel applications, particularly in-body and medical diagnostics devices. However, future advanced SE miniature devices will require high-density, extremely stretchable…
The upgrade to the High Luminosity Large Hadron Collider will pose unprecedented challenges to the tracking systems of all experiments. Recent advancement of active pixel detectors designed in CMOS processes provide attractive alternatives…
The semiconductor industry is experiencing a significant shift from traditional methods of shrinking devices and reducing costs. Chip designers actively seek new technological solutions to enhance cost-effectiveness while incorporating more…
Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are…
The rapid growth of data-intensive applications such as generative AI, scientific simulations, and large-scale analytics is driving modern supercomputers and data centers toward increasingly heterogeneous and tightly integrated…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
Emerging applications such as autonomous driving and Internet of things (IoT) services put forward the demand for simutaneous sensing and communication functions in the same system. Integrated sensing and communication (ISAC) has the…
Collider detectors have taken advantage of the resolution and accuracy of silicon detectors for at least four decades. Future colliders will need large areas of silicon sensors for low mass trackers and sampling calorimetry. Monolithic…
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale…
Data collection and processing in advanced health monitoring systems are experiencing revolutionary change. In-Sensor Computing (ISC) systems emerge as a promising alternative to save energy on massive data transmission, analog-to-digital…
At least 25 kinds of detector-like devices need to be integrated in Phase I of the High Energy Photon Source (HEPS), and the work needs to be carefully planned to maximise productivity with highly limited human resources. After a systematic…
The development of tactile sensing is expected to enhance robotic systems in handling complex objects like deformables or reflective materials. However, readily available industrial grippers generally lack tactile feedback, which has led…
The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first solution was designed to interface a capacitive humidity sensor…
Integrated Sensing And Communication (ISAC ) systems are expected to perform accurate radar sensing while having minimal impact on communication. Ideally, sensing should only reuse communication resources, especially for spectrum which is…
On the advent of the slow death of Moore's law, the silicon industry is moving towards a new era of chiplets. The automotive industry is experiencing a profound transformation towards software-defined vehicles, fueled by the surging demand…
CMOS pixel sensors (CPS) represent a novel technological approach to building charged particle detectors. CMOS processes allow to integrate a sensing volume and readout electronics in a single silicon die allowing to build sensors with a…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…