Related papers: Selection of High Strength Encapsulant for MEMS De…
In Micro-electro-mechanical Systems (MEMS) based pressure sensors and acoustic devices, deflection of a membrane is utilized for pressure or sound measurements. Due to advantages of capacitive pressure sensor over piezoresistive pressure…
Epoxy is widely used primarily as a matrix material in the manufacture of polymer matrix composite. Epoxy behavior under compression load has to be understood before the mechanical behavior of polymer matrix composite can be accurately…
Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…
We systematically investigate the influence of polyvinyl formal (PVFM), commonly known as Formvar, in comparison to polycarbonate (PC) and polymethyl methacrylate (PMMA), as encapsulation materials on the strain performance of MoS2…
The study of the high strain rate mechanical behaviour of materials using micropillar compression tests has been hindered so far due to the lack of suitable instrumentation. In the present study, a novel high strain rate micropillar…
This study is focused on the mechanical characterization of materials used in microelectronic and micro- electromechanical systems (MEMS) devices. In order to determine their mechanical parameters, a new deformation bench test with suitable…
For decades, mechanical resonators with high sensitivity have been realized using thin-film materials under high tensile loads. Although there have been remarkable strides in achieving low-dissipation mechanical sensors by utilizing high…
In this paper, a capacitive flexible tactile sensor was designed to measure the pressure of objects based on MEMS technology. This sensor is a structure of a 4x4 array, with metal Ag as the capacitive electrode, which forms the tactile…
Advances in additive manufacturing (AM) enable new opportunities to design compact heat exchangers (cHEXs) by leveraging flexible geometries to improve energy and material efficiency. However, it is well known that reducing size in…
A FEM application for the accurate design of composite backing of ultrasonic transducers is presented. The idea is to obtain the dependence between the volume ratio of the tungsten powder in an epoxy matrix used as a backing and the final…
One of the standard composite insulation systems for cryogenic applications consists of a layer of hollow glass microspheres (HGMs) followed by a layer of variable density multilayer insulation (VDMLI) comprised of various internal…
Highly flexible electromagnetic interference (EMI) shielding material with excellent shielding performance is of great significance to practical applications in next-generation flexible devices. However, most EMI materials suffer from…
Properties of typical MEMS materials have been widely investigated. Mechanical properties of MEMS structures depend not only on the bulk material properties, but also structural factors. A measurement system has been made to measure…
In large area micro hot embossing, the process temperature plays a critical role to both the local fidelity of microstructure formation and global uniformity. The significance of low temperature hot embossing is to improve global flatness…
Flexible graphite (FG) with 1 - 1.2 g/cm$^3$ density is employed as beam energy absorber material in the CERN's Large Hadron Collider (LHC) beam dumping system. However, the increase of energy deposited expected for new HL-LHC…
Conformable Electronics refers to a class of electronic devices that have the ability to conformally adhere onto non-planar surfaces and materials, resulting particularly appealing for skin applications, such as the case of skin-worn…
We perform an extensive combinatorial search for optimal nanostructured hydrogen storage materials among various metal-decorated polymers using first-principles density-functional calculations. We take into account the zero-point vibration…
Microcapsules are a key class of microscale materials with applications in areas ranging from personal care to biomedicine, and with increasing potential to act as extracellular matrix (ECM) models of hollow organs or tissues. Such capsules…
Molding compounds (MCs) have been used extensively as an encapsulation material for integrated circuits, however, MCs are susceptible to moisture and charge spreading over time. The increase in dissipation factor due to the increase of…
Most measurements of compressive strength of ductile materials have involved Hopkinson-Kolsky bars or Taylor anvils placing samples in uniaxial compression. In these geometries strain is limited by the tendency of the sample to petal, in…