Related papers: High Performance Thermal Interface Technology Over…
Maintaining temperature is crucial in both daily life and industrial settings, ensuring human comfort and device functionality. In the quest for energy conservation and emission reduction, several contemporary passive temperature control…
The electronic properties of interfaces between two different solids can differ strikingly from those of the constituent materials. For instance, metallic conductivity, and even superconductivity, have been recently discovered at interfaces…
Controlling and detecting thermal radiation is of vital importance for varied applications ranging from energy conversion systems and nanoscale information processing devices to infrared imaging, spectroscopy and sensing. We review the…
The paper presents the comparative study of the vortex-induced cooling of a heated channel for the four different cross-sections of the rigid cylinder, i.e., circular, square, semi-circular, and triangular, with or without the…
A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…
We propose an experimentally feasible scheme for topological interface engineering and show how it can be used for studies of dynamics of topologically nontrivial interfaces and perforation of defects and textures across such interfaces.…
Recent advances in our understanding of thermal transport in nanocrystalline systems are responsible for the integration of new technologies into advanced energy systems, including thermoelectric refrigeration systems and renewable energy…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
We predict the structural interaction of crystalline solid-melt interfaces using amplitude equations which are derived from classical density functional theory or phase-field-crystal modeling. The solid ordering decays exponentially on the…
Degradation in performances of air conditioners and refrigerators is caused by a frost formation and adhesion on the surface. In the present study, by means of the classical molecular dynamics simulation, we investigate how and how much the…
Technological progress in electronics usually requires their use in increasingly aggressive environments, such as rapid thermal cycling and high power density. Thermal diodes appear as excellent candidates to thermally protect critical…
We argue that the relative thermal conductance between interfaces with different morphologies is controlled by crystal structure through $M_{min}/M_c > 1$, the ratio between the {\it minimum mode} count on either side $M_{min}$, and the…
Some of the most exciting recent advancements in heat conduction physics have been motivated, enabled, or achieved by the thermal management community that ITherm serves so effectively. In this paper we highlight the resulting renaissance…
Low temperature covalent direct wafer-wafer bonding allows for the fusion of multiple semiconductor wafers without any additional material at the bonding interface. In the context of particle pixel detectors this might provide an…
Air-to-air heat exchangers are vital for energy recovery and thermal management but often suffer from reduced effectiveness, high pressure losses, and increased pumping power in conventional designs. Advances in additive manufacturing have…
Crystalline materials with ultralow thermal conductivity are highly desirable for thermoelectric applications. Many known crystalline materials with low thermal conductivity, including PbTe and Bi2Te3, possess a special kind of chemical…
Heat transfer in semiconductor devices is dominated by chip and substrate assemblies, where heat generated within a finite chip layer dissipates into a semi-infinite substrate with much higher thermophysical properties. This mismatch…
Many objects of nanoscopic dimensions involve fluid-tethered chain interfaces. These systems are of interest for basic science and for several applications, in particular for design of nanodevices for specific purposes. We review recent…
Recent experimental investigations have demonstrated that doping a semiconductor is a route to increase the thermal boundary conductance at metal/semiconductor interfaces. In this work, the influence of the electrical properties on heat…
Despite the desirability of polymers for use in many products due to their flexibility, light weight, and durability, their status as thermal insulators has precluded their use in applications where thermal conductors are required. However,…