Related papers: High Performance Thermal Interface Technology Over…
This paper presents a novel fabric-based thermal-haptic interface for virtual reality and teleoperation. It integrates pneumatic actuation and conductive fabric with an innovative ultra-lightweight design, achieving only 2~g for each finger…
Thin liquid films on surfaces are part of our everyday life, they serve e.g. as coatings or lubricants. The stability of a thin layer is governed by interfacial forces, described by the effective interface potential, and has been subject of…
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this project are to produce and demonstrate the efficiency of the…
Lack of materials which are thermoelectrically efficient and economically attractive is a challenge in thermoelectricity. Silicon could be a good thermoelectric material offering CMOS compatibility, harmlessness and cost reduction but it…
In this paper we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermo-mechanical simulation were performed to study the thermal and…
Thermal Desktop (TD) is an industry-standard thermal analysis tool used to create and analyze thermal models for landers, rovers, spacecraft, and instrument payloads. Currently, limited software exists to extract and visualize metrics…
The inherent trade-off between ultra-low thermal conductivity and high mechanical rigidity in natural materials limits their utility in advanced applications. Inspired by the unique architecture of layered honeycomb structures, this study…
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication…
By combining Three Dimensional Integrated Circuits with the Network-on-Chip infrastructure to obtain 3D Networks-on-Chip (3D-NoCs), the new on-chip communication paradigm brings several advantages on lower power, smaller footprint and lower…
Thermal properties of a two-layered composite conductor are modified in case the interface is damaged. The present paper deals with nondestructive evaluation of perturbations of interface thermal conductance due to the presence of defects.…
A methodology is presented for estimating average values for the temperature and the frictional traction over a tool-workpiece interface using measured values of force and torque applied to the tool. The approach was developed specifically…
Topological insulators (TIs) are bulk insulators that possess robust helical conducting states along their interfaces with conventional insulators. A tremendous research effort has recently been devoted to TI-based heterostructures, in…
The thermal transport properties of porous silicon and nano-hybrid "porous silicon/water" systems are presented here. The thermal conductivity was evaluated with equilibrium molecular dynamics technique for porous systems made of spherical…
We investigate the effective coupling between heat and fluid dynamics within a thin fluid layer in contact with a solid structure via a rough surface. Moreover, the opposing vertical surfaces of the thin layer are in relative motion. This…
Nonlinear heat transfer can be exploited to reveal novel transport phenomena and thus enhance peo-ple's ability to manipulate heat flux at will. However, there hasn't been a mature discipline called nonlinear thermotics like its counterpart…
Thermal annealing is a widely used thin-film processing technique for modifying interfacial optical losses and electronic scattering in plasmonic materials. Here, we investigate how thermal annealing of gold thin films deposited on silicon…
In equilibrium the interface potential that describes the interaction between two AB interfaces in a binary blend of A and B homopolymers is attractive at all distances, resulting in coarsening of the blend morphology even in the absence of…
In this article, to study the heat flow behavior, we perform analytical investigations in a rotor chain type model (involving inner stochastic noises) with next and next-nearest-neighbor interactions. It is known in the literature that the…
The methods of non-equilibrium thermodynamics of systems with an interface have been applied to the study of thermionic emission processes in abrupt semiconductor junctions, including the effects of surface states . Our analysis covers…
We report measurements of resonant thermal capillary oscillations of a hemispherical liquid gas interface obtained using a half bubble deposited on a solid substrate. The thermal motion of the hemispherical interface is investigated using…