Related papers: High Performance Thermal Interface Technology Over…
Development of the next generation thermal interface materials with high thermal conductivity is important for thermal management and packaging of electronic devices. We report on the synthesis and thermal conductivity measurements of…
The newest and most powerful electronic chips for applications like artificial intelligence generate so much heat that liquid based cooling has become indispensable to prevent breakdown from thermal runaway effects. While cooling schemes…
We present an introduction to modern theories of interfacial fluctuations and the associated interfacial parameters: surface tension and surface stiffness, as well as their interpretation within the capillary wave model. Transfer matrix…
Interface undercooling is one of the most significant parameters in the solidification of colloidal suspensions. However, quantitative measurement of interface undercooling of colloidal suspensions is still a challenge. Here, a new…
Thermal contact has always been a hot issue in many engineering fields and thermal contact resistance (TCR) is one of the important indicators weighing the heat transfer efficiency among the interfaces. In this paper, the contact heat…
Heat transfer in nanocomposite materials has attracted great interest for various applications. Multilayer structures provide an important platform to study interfacial thermal transport and to engineer materials with ultralow thermal…
Transmission and distribution dynamic co-simulation is a practical and effective approach to leverage existing simulation tools for transmission and distribution systems to simulate dynamic stability and performance of transmission and…
Thermal conductivity of a model glass-forming system in the liquid and glass states is studied using extensive numerical simulations. We show that near the glass transition temperture, where the structural relaxation time becomes very long,…
We consider heterostructures obtained by stacking layers of two s-wave superconductors with significantly different coupling strengths, respectively in the weak- and strong-coupling regimes. The weak- and strong-coupling superconductors are…
Polymers are usually considered as thermal insulators and their applications are limited by their low thermal conductivity. However, recent studies showed that certain polymers have surprisingly high thermal conductivity, some of which are…
At the nanoscale, the thermal boundary conductance (TBC) and thermal conductivity are not intrinsic properties of interfaces or materials but depend on the nearby environment. However, most studies focused on single interfaces or…
Thermal emission caused by the thermal motion of the charged particles is commonly broadband, un-polarized, and incoherent, like a melting pot of electromagnetic waves, which makes it unsuitable for infrared applications in many cases…
Developing thermal analogues of field-effect transistor could open the door to a low-power and even zero-power communication technology working with heat rather than electricity. These solid-sate devices could also find many applications in…
When heat transfers through interface between two different materials, it will encounter an interfacial thermal resistance (ITR) that makes the temperature discontinuous. This effect has been totally neglected so far in the research of…
This article covers thermodynamic, dynamic, and kinetic models that are suitable for the analysis of wetting, adsorption, and related interfacial phenomena in colloidal and multiphase systems. Particular emphasis is made on describing…
Quantum devices, which rely on quantum mechanical effects for their operation, may offer advantages, such as reduced dimensions, increased speed, and energy efficiency, compared to conventional devices. However, quantum phenomena are…
We will study a class of system composed of interacting unicyclic machines placed in contact with a hot and cold thermal baths subjected to a non-conservative driving worksource. Despite their simplicity, these models showcase an intricate…
The emergence of data-driven science has opened up new avenues for understanding the thermophysical properties of materials. For decades, alloys are known to possess very low thermal conductivity, but the extreme thermal conductivity can be…
In this paper, we study the effects of the interparticle interaction range on heat flow. We show that, by increasing the interaction range, we may amplify the thermal conductivity and even change the regime of heat transport. More…
Triply Periodic Minimal Surface (TPMS) structures are attracting growing attention as promising geometries for next-generation high-performance heat exchangers (HXs), due to their continuous flow paths and high surface-area-to-volume ratio…