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Lumped parameter methods aim to simplify the evolution of spatially-extended or continuous physical systems to that of a "lumped" element representative of the physical scales of the modeled system. For systems where the definition of a…

Machine Learning · Computer Science 2023-04-19 James Koch , WoongJo Choi , Ethan King , David Garcia , Hrishikesh Das , Tianhao Wang , Ken Ross , Keerti Kappagantula

Active thermal control is crucial in achieving the required accuracy and throughput in many industrial applications, e.g., in the medical industry, high-power lighting industry, and semiconductor industry. Thermoelectric Modules (TEMs) can…

Systems and Control · Electrical Eng. & Systems 2020-06-19 Enzo Evers , Rens Slenders , Rob van Gils , Tom Oomen

The modeling of deposition rates in Thermal Laser Epitaxy (TLE) is essential for the accurate prediction of the evaporation process and for improved dynamic process control. We demonstrate excellent agreement between experimental data and a…

Computational Engineering, Finance, and Science · Computer Science 2025-01-06 Thomas J. Smart , Bilen Emek Abali , Hans Boschker , Wolfgang Braun

This work introduces an ensemble parameter estimation framework that enables the Lumped Parameter Linear Superposition (LPLSP) method to generate reduced order thermal models from a single transient dataset. Unlike earlier implementations…

Numerical Analysis · Mathematics 2026-05-26 Neelakantan Padmanabhan

When designing and studying circuits operating at cryogenic temperatures understanding local heating within the circuits is critical due to the temperature dependence of transistor and noise behavior. We have investigated local heating…

Materials Science · Physics 2010-08-23 J. Hamlet , K. Eng , T. Gurrieri , J. Levy , M. Carroll

Simplifying the constitutive behaviour of a material in terms of the lumped parameter elements is useful to design plant models in control engineering. In this contribution, a lumped parameter modelling approach is used to represent the…

Soft Condensed Matter · Physics 2015-12-03 S. Maniprakash

Accelerated cooling is a key technology in producing thermomechanically controlled processed (TMCP) steel plates. In a TMCP process hot plates are subjected to a strong cooling what results in a complex microstructure leading to increased…

Numerical Analysis · Mathematics 2019-12-30 Dimitri Rothermel , Thomas Schuster , Roland Schorr , Martin Peglow

The thermal and mechanical behaviors of powders are important for various additive manufacturing technologies. For powder bed fusion, capturing the temperature profile and the packing structure of the powders prior to melting is challenging…

Soft Condensed Matter · Physics 2024-02-26 Sudeshna Roy , Hongyi Xiao , Vasileios Angelidakis , Thorsten Pöschel

Thermoelectric (TE) air cooling is a solid-state technology that has the potential to replace conventional vapor compression-based air conditioning. In this paper, we present a detailed system-level modeling for thermoelectric air…

Applied Physics · Physics 2020-11-06 Abhishek Saini , Sarah J. Watzman , Je-Hyeong Bahk

The suspended electrothermal polysilicon micro beams generate displacements and forces by thermal buckling effects. In the previous electro-thermal and thermo-elastic models of suspended polysilicon micro beams, the thermo-mechanical…

Other Computer Science · Computer Science 2008-02-22 M. Shamshirsaz , M. Bahrami , M. B. Asgari , M. Tayefeh

With electric power systems becoming more compact and increasingly powerful, the relevance of thermal stress especially during overload operation is expected to increase ceaselessly. Whenever critical temperatures cannot be measured…

Machine Learning · Computer Science 2022-11-03 Wilhelm Kirchgässner , Oliver Wallscheid , Joachim Böcker

This paper focuses on multiscale dynamics occurring in steam supply systems. The dynamics of interest are originally described by a distributed-parameter model for fast steam flows over a pipe network coupled with a lumped-parameter model…

Dynamical Systems · Mathematics 2023-05-15 Hikaru Hoshino , Yoshihiko Susuki , Takashi Hikihara

Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…

Signal Processing · Electrical Eng. & Systems 2020-06-15 Jakub Ševčík , Václav Šmídl , Ondřej Straka

In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effec-tive dissipation of heat. This can be achieved by the optimization of the system design…

Materials Science · Physics 2007-09-13 R. Schacht , D. May , B. Wunderle , O. Wittler , A. Gollhardt , B. Michel , H. Reichl

The next generation of ultra-low-noise cryogenic detectors for space science applications require continued exploration of materials characteristics at low temperatures. The low noise and good energy sensitivity of current Transition Edge…

Mesoscale and Nanoscale Physics · Physics 2011-02-01 D. J. Goldie , D. M. Glowacka , K. Rostem† , S. Withington

Quantifying the temperature of microdevices is critical for probing nanoscale energy transport.Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become…

Mesoscale and Nanoscale Physics · Physics 2021-05-05 Amin Reihani , Shen Yan , Yuxuan Luan , Rohith Mittapally , Edgar Meyhofer , Pramod Reddy

The method consists in the monitoring of the temperature variation of a superconductor tape subjected to a trapezoidal current pulse. Simulations of the experiment were performed using the lumped capacitance model and also the finite…

Superconductivity · Physics 2007-05-23 Benoit des Ligneris Marcel Aubin Julian Cave

This data set descriptor introduces a structured, high-resolution dataset of transient thermal simulations for a vertical axis of a machine tool test rig. The data set includes temperature and heat flux values recorded at 29 probe locations…

Computational Engineering, Finance, and Science · Computer Science 2025-09-23 C. Coelho , D. Fernández , M. Hohmann , L. Penter , S. Ihlenfeldt , O. Niggemann

Imperfections in correlated materials can alter their ground state as well as finite-temperature properties in significant ways. Here, we develop a method based on numerical linked-cluster expansions for calculating exact finite-temperature…

Strongly Correlated Electrons · Physics 2019-05-15 Michael Mulanix , Demetrius Almada , Ehsan Khatami

As technology scales down, the static power is expected to become a significant fraction of the total power. The exponential dependence of static power with the operating temperature makes the thermal profile estimation of high-performance…

Hardware Architecture · Computer Science 2011-11-09 J. L. Rossello , V. Canals , S. A. Bota , A. Keshavarzi , J. Segura
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