Related papers: Lumped and Distributed Parameter SPICE Models of T…
In the coordinate representation of thermofield dynamics, we investigate the thermalized displaced squeezed thermal state which involves two temperatures successively. We give the wavefunction and the matrix element of the density operator…
Finite element models without simplifying assumptions can accurately describe the spatial and temporal distribution of heat in machine tools as well as the resulting deformation. In principle, this allows to correct for displacements of the…
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management play important role in case of power LEDs, necessitating both physical…
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
The principles of the thermoelectric phenomenon, including Seebeck effect, Peltier effect, and Thomson effect are discussed. The dependence of the thermoelectric devices on the figure of merit, Seebeck coefficient, electrical conductivity,…
In this article, we present an improved version of the PULSE method (Partition function Unsupervised Learning Sampling and Evaluation) for estimating the thermodynamic properties of chemically disordered compounds. The aim is to reduce the…
In this article we propose and numerically implement a mathematical model for the simulation of three-dimensional semiconductor devices characterized by an heterogeneous material structure. The model consists of a system of nonlinearly…
Piezoelectricity of some materials has shown to have many applications, in particular in energy harvesting. Due to the inherent hysteresis in the characteristic of such materials, a number of hysteretic models have been proposed minding the…
Reconstructing a thermal model capable of efficiently simulating the behavior of a spacecraft from sparse and localized temperature measurements remains a challenging task. To address this, we introduce a physically-constrained calibration…
A study of the thermal properties of two-dimensional topological lattice models is presented. This work is relevant to assess the usefulness of these systems as a quantum memory. For our purposes, we use the topological mutual information…
It was shown by several authors that closed high pressure arc a.c. discharge in mercury vapors with addition of metal halide cannot be described in frames of the local thermodynamic equilibrium (LTE) model. However some plasma parameters…
Simulation results are presented to demonstrate electron temperature and electrical potential development in dilute and cold plasma development. The simulation method is a hybrid method which adopted fluid model for electrons due to their…
We study the differential equations of lumped-parameter models of spacecraft thermal control. Firstly, we consider a satellite model consisting of two isothermal parts (nodes): an outer part that absorbs heat from the environment as…
This paper aimed at extending a model developed by Ladeveze to capture thermal expansion and coupled thermo-mechanical phenomena, as such as those encountered at elevated and extreme temperatures. In the new model a linear thermal expansion…
In this work we study the recently developed parametrized partition function formulation and show how we can infer the thermodynamic properties of fermions based on numerical simulation of bosons and distinguishable particles at various…
A three-way coupled thermo-mechanical fracture model is presented to predict the damage of brittle ceramics, in particular {\alpha}-SiC, over a wide range of temperatures (20-1400 C). Predicting damage over such a range of temperatures is…
We report a model-based method for quantifying heat flow and storage in thermal systems using data from multiple thermal sensors. This approach avoids stringent requirements on the system geometry and sensor positions and enables…
A method to measure thermophysical characteristics (TPC) of conductive materials is described. The method is based upon controlled bulk (e.g., Ohmic) heating and measurement of the averaged over the volume of a sample temperature and the…
We present an ab-initio study of the temperature dependent elastic constants of BAs, a semiconductor that exhibits ultra-high thermal conductivity and is under investigation for thermal management in electronics. We test the consistency of…