Related papers: Vibration Combined High Temperature Cycle Tests fo…
This paper presents the design, simulation, and analytical modeling of the single proposed axis MEMSbased capacitive accelerometer. Analytical modeling has been done for frequency and displacement sensitivity. The performance of the…
This paper presents an optimized silicon-MEMS electromagnetic vibration energy harvester suitable for applications such as machine health monitoring. The harvester comprises a DRIE-etched silicon suspension, and pick-and-place N42 NdBFe…
MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors.…
We demonstrate the capabilities of a high temperature measurement set-up recently developed at our institute. It is dedicated to the characterization of semiconductor devices and test structures in the temperature range from room…
AC power cycling tests allow the most realistic reliability assessment by applying close to real stress to the device or module under test to meet functional safety standards, which is highly critical for traction applications. This paper…
This article presents an evaluation of off-the-shelf commercial accelerometers at the mixing chamber stage of a cryogen-free dilution refrigerator at temperatures down to 8 mK. In addition, we present results of radioassay of accelerometer…
In this research, the AED was modeled with the Ansys 2020 workbench and calibrated based on static and dynamic loading to verify the static displacement with the first set of five frequencies obtained based on the un-prestressed conditions.…
Triaxial vibration sensor are widely used used in various application. Recently, low-cost sensors based on micro electro mechanical system (MEMS) technology are also becoming more widely adopted. However, their measurement accuracy can be…
We present simulations of the dynamic and temperature dependent behavior of Micro-Electro-Mechanical Systems (MEMS) by utilizing recently developed parallel codes which enable a coupling of length scales. The novel techniques used in this…
Accelerated degradation tests are used to provide accurate estimation of lifetime properties of highly reliable products within a relatively short testing time. There data from particular tests at high levels of stress (e.\,g.\ temperature,…
This paper demonstrates a vibration test for a resonant MEMS scanning system in operation to evaluate the vibration immunity for automotive lidar applications. The MEMS mirror has a reinforcement structure on the backside of the mirror,…
This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface…
As part of its HL-LHC upgrade program, the CMS Collaboration is developing a High Granularity Calorimeter (CE) to replace the existing endcap calorimeters. The CE is a sampling calorimeter with unprecedented transverse and longitudinal…
Thermal convection based micro-electromechanical accelerometer is a relatively new kind of acceleration sensor that does not require a solid proof mass, yielding unique benefits like high shock survival rating, low production cost, and…
We have designed and characterized micro-electro-mechanical systems (MEMS) for applications at low temperatures. The mechanical resonators were fabricated using a surface micromachining process. The devices consist of a pair of parallel…
This paper presents the study of an original closed-loop conditioning approach for fully-integrated convective inertial sensors. The method is applied to an accelerometer manufactured on a standard CMOS technology using an auto-aligned bulk…
The stability of Al-Mn transition edge sensor (TES) bolometers is studied as we vary the engineered TES transition, heat capacity, and/or coupling between the heat capacity and TES. We present thermal structure measurements of each of the…
The readout electronics of a Micromegas (MM) module consume nearly 26 W of electric power, which causes the temperature of electronic board to increase upto $70\,^{\circ}{\rm C}$. Increase in temperature results in damage of electronics.…
Active microelectromechanical systems can couple the nanomechanical domain with the electronic domain by integrating electronic sensing and actuation mechanisms into the micromechanical device. This enables very fast and sensitive…
The dynamic behavior of a capacitive micro-electro-mechanical (MEMS) accelerometer is evaluated by using a theoretical approach which makes use of a squeeze film damping (SFD) model and ideal gas approach. The study investigates the…