Related papers: 3-D Self-Assembled Soi Mems: An Example of Multiph…
The build up of polyelectrolyte multilayers (PEMs) was observed by a silicon-on-insulator (SOI) based thin film resistor. Differently charged polyelectrolytes adsorbing to the sensor surface result in defined potential shifts, which…
Increasing complexity in the power system and the transformation towards a smart grid lead to the necessity of new tools and methods for the development and testing of new technologies. One testing method is co-simulation, which allows…
Scanning micro-mirror actuators are silicon-based oscillatory micro-electro-mechanical systems (MEMS). They enable laser distance measurements for automotive LIDAR applications as well as projection modules for the consumer market. For MEMS…
The aim of this paper is to deal with multi-physics simulation of micro-electro-mechanical systems (MEMS) based on an advanced numerical methodology. MEMS are very small devices in which electric as well as mechanical and fluid phenomena…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
Modeling and Simulation (M&S) is finding increasing application in development and testing of command and control systems comprised of information-intensive component systems. Achieving interoperability is one of the chief System of Systems…
This paper presents an integrated multiphysics simulation approach of piezoelectric micropumps. Micropumps and micro blowers are essential devices in various cutting-edge industries like laboratory equipment, medical devices, and fuel…
Electro-thermally actuated origami provides a novel method for creating 3-D systems with advanced morphing and functional capabilities. However, it is currently difficult to simulate the multi-physical behavior of such systems because the…
Application of new detectors using Silicon-On-Insulator (SOI) technology has been started in the Photon Factory, KEK. This project has two purposes. The first purpose is to develop a pulse-counting-type X-ray detector which can be used in…
In this paper, we introduce a new approach to fabricate under the Silicon on Insulator (SOI) platform a 1x2 power splitter and scale it to 1xN system device from the proposed model. The current strategy of design is based on the well-known…
Shielding sensitive scientific and medical devices from the magnetic field environment is one of the promising applications of superconductors. Magnetic field concentration by superconducting magnetic lenses is the opposite phenomenon…
The rapid progress in nanofabrication technologies has led to the emergence of new classes of nanodevices and structures. At the atomic scale of novel nanostructured semiconductors the distinction between new device and new material is…
Understanding the mechanical interplay between silicon anodes and their surrounding solid-electrolyte interphase (SEI) is essential to improve the next generation of lithium-ion batteries. We model and simulate a 2D elliptical silicon…
An easy procedure to build up membrane-electrode assemblies for applications dedicated to miniaturized PEMFC using H2 or CH3OH by a two-steps atmospheric plasma process is reported. Firstly, catalyst nanoparticles are grafted on carbon…
Three-dimensional nanoarchitectures are widely used across various areas of physics, including spintronics, photonics, and superconductivity. In this regard, thin curved 3D membranes are especially interesting for applications in nano- and…
Co-simulation consists of the theory and techniques to enable global simulation of a coupled system via the composition of simulators. Despite the large number of applications and growing interest in the challenges, the field remains…
Existing solid state drive (SSD) simulators unfortunately lack hardware and/or software architecture models. Consequently, they are far from capturing the critical features of contemporary SSD devices. More importantly, while the…
Three-dimensional (3D) topological insulators (TIs) are candidate materials for various electronic and spintronic devices due to their strong spin-orbit coupling and unique surface electronic structure. Rapid, low-cost preparation of…
The reduction of the thermal conductivity in nanostructures opens up the possibility of exploiting for thermoelectric purposes also materials such as silicon, which are cheap, available and sustainable but with a high thermal conductivity…
The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first solution was designed to interface a capacitive humidity sensor…