Phase mask fabrication for multi-plane light conversion using grayscale lithography
Abstract
Direct writing laser (DWL) grayscale lithography is introduced as a novel fabrication technique for multi-plane light conversion (MPLC) phase masks, enabling direct transfer of precise depth profiles onto substrates via reactive ion etching and subsequent reflective coating. An MPLC system employing these masks achieves 92% fidelity in converting a Gaussian (TEM (0,0)) input to a Laguerre-Gaussian (LG(0,0)) mode. The fabricated masks exhibit sub-10 nm vertical resolution, surface roughness below 3 nm, and an R-squared value of 0.976. This method provides a scalable alternative to conventional multi-step lithographic fabrication for advanced photonic systems.
Cite
@article{arxiv.2507.10405,
title = {Phase mask fabrication for multi-plane light conversion using grayscale lithography},
author = {Sudip Gurung and Seth Smith Dryden and Keqi Qin and Guifang Li},
journal= {arXiv preprint arXiv:2507.10405},
year = {2025}
}
Comments
We are in a process of geting authorization from University of Central Florida for the paper to be published. Therefore, we need to redact the manuscript for now