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Electrostatic Engineering using Extreme Permittivity Materials for Ultra-wide Bandgap Semiconductor Transistors

Applied Physics 2020-06-04 v1 Materials Science

Abstract

The performance of ultra-wide band gap materials like β\beta-Ga2_\mathrm{2}O3_\mathrm{3} is critically dependent on achieving high average electric fields within the active region of the device. In this report, we show that high-k gate dielectrics like BaTiO3_\mathrm{3} can provide an efficient field management strategy by improving the uniformity of electric field profile in the gate-drain region of lateral field effect transistors. Using this strategy, we were able to achieve high average breakdown fields of 1.5 MV/cm and 4 MV/cm at gate-drain spacing (Lgd_\mathrm{gd}) of 6 um and 0.6 um respectively in β\beta-Ga2_\mathrm{2}O3_\mathrm{3}, at a high channel sheet charge density of 1.8x1013^\mathrm{13}cm2^\mathrm{-2}. The high sheet charge density together with high breakdown field enabled a record power figure of merit (V2^\mathrm{2}br_\mathrm{br}/Ron_\mathrm{on}) of 376 MW/cm2^\mathrm{2} at a gate-drain spacing of 3 um.

Keywords

Cite

@article{arxiv.2006.02349,
  title  = {Electrostatic Engineering using Extreme Permittivity Materials for Ultra-wide Bandgap Semiconductor Transistors},
  author = {Nidhin Kurian Kalarickal and Zixuan Feng and A F M Anhar Uddin Bhuiyan and Zhanbo Xia and Joe F. McGlone and Wyatt Moore and Aaron R. Arehart and Steven A. Ringel and Hongping Zhao and Siddharth Rajan},
  journal= {arXiv preprint arXiv:2006.02349},
  year   = {2020}
}
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