Some possible applications of the low-angle mid-IR-light scattering technique and some recently developed on its basis methods for non-destructive inspection and investigation of semiconductor materials and structures are discussed in the paper. The conclusion is made that the techniques in question might be very useful for solving a large number of problems regarding defect investigations and quality monitoring both in research laboratories and the industry of microelectronics
@article{arxiv.1106.1327,
title = {Application of elastic mid-IR-laser-light scattering for non-destructive inspection in microelectronics},
author = {V. P. Kalinushkin and V. A. Yuryev and O. V. Astafiev and A. N. Buzynin and N. I. Bletskan},
journal= {arXiv preprint arXiv:1106.1327},
year = {2015}
}
Comments
MRS Spring Meeting, San Francisco, USA, 17-21 April 1995