As artificial intelligence (AI) chips become more powerful, the thermal management capabilities of conventional silicon (Si) substrates become insufficient for 3D-stacked designs. This work integrates electrically insulative and thermally conductive hexagonal boron nitride (h-BN) interposers into AI chips for effective thermal management. Using COMSOL Multiphysics, the effects of High-Bandwidth Memory (HBM) distributions and thermal interface material configurations on heat dissipation and hotspot mitigation were studied. A 20 {\deg}C reduction in hot spots was achieved using h-BN interposers compared to Si interposers. Such an improvement could reduce AI chips' power leakage by 22% and significantly enhance their thermal performance.
Cite
@article{arxiv.2510.11461,
title = {Thermal Analysis of 3D GPU-Memory Architectures with Boron Nitride Interposer},
author = {Eric Han Wang and Weijia Yan and Ruihong Huang},
journal= {arXiv preprint arXiv:2510.11461},
year = {2025}
}