We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.
@article{arxiv.2201.10425,
title = {Qubit-compatible substrates with superconducting through-silicon vias},
author = {K. Grigoras and N. Yurttagül and J. -P. Kaikkonen and E. T. Mannila and P. Eskelinen and D. P. Lozano and H. -X. Li and M. Rommel and D. Shiri and N. Tiencken and S. Simbierowicz and A. Ronzani and J. Hätinen and D. Datta and V. Vesterinen and L. Grönberg and J. Biznárová and A. Fadavi Roudsari and S. Kosen and A. Osman and M. Prunnila and J. Hassel and J. Bylander and J. Govenius},
journal= {arXiv preprint arXiv:2201.10425},
year = {2022}
}
Comments
Accepted version. 11 pages, 7 figures, 2 tables with appendices included