A novel way of filling high aspect ratio vertical interconnection (microvias) with an aspect ratio of >2:1 is presented. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst-diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. Higher throughput and better control over the deposition properties are possible for the manufacturing of interconnections and metal-based MEMS.
@article{arxiv.0805.0860,
title = {Megasonic Enhanced Electrodeposition},
author = {Jens Georg Kaufmann and Marc Desmulliez and D. Price},
journal= {arXiv preprint arXiv:0805.0860},
year = {2008}
}
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Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)