Related papers: Monolithic CMOS Pixel R&D for the ILC at LBNL
It is expected that the LHC accelerator and experiments will undergo a luminosity upgrade which will commence after several years of running. This part of the LHC operations is referred to as Super-LHC (SLHC) and is expected to provide…
The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new…
Pixel vertex detectors are THE instrument of choice for the tracking of charged particles close to the interaction point at the LHC. Hybrid pixel detectors, in which sensor and read-out IC are separate entities, constitute the present state…
A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to…
High-voltage CMOS (HV-CMOS) pixel technology is being considered for future Higgs factory experiments. The ATLASPix3.1 chip, with a pitch of 50$\mu m$ x 150$\mu m$, fabricated using TSI 180nm HV-CMOS technology, is a full reticle-size…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
The high-luminosity high-energy Electron-Ion Collider (EIC) to be built at Brookhaven National Laboratory (BNL) will provide a clean environment to study several fundamental questions in the high energy and nuclear physics fields. A high…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
The ATLAS detector has to undergo significant updates at the end of the current decade, in order to withstand the increased occupancy and radiation damage that will be produced by the high-luminosity upgrade of the Large Hadron Collider. In…
The ATLAS experiment, at the Large Hadron Collider, will incorporate discrete, high-resolution tracking sub-systems in the form of segmented silicon detectors with 40MHz radiation-hard readout electronics. In the region closest to the pp…
The ILD concept, one of two proposed detector concepts for the planned International Linear Collider (ILC), foresees a Time Projection Chamber (TPC) as the main tracking detector. The LCTPC (Linear Collider TPC) collaboration pursues R&D to…
A demonstrator for each slice of the ATLAS pixel detector was built to replicate the real detector and provide early solutions for operating and maintaining its components. This system-level testing of the all-silicon Inner Tracker (ITk)…
Monolithic stitched CMOS sensors are explored for the upgrade of Inner Tracking System of the ALICE experiment (ITS3) and the R&D of the CERN Experimental Physics Department. To learn about stitching, two 26 cm long stitched sensors, the…
A new pixel detector for the CMS experiment was built in order to cope with the instantaneous luminosities anticipated for the Phase~I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking with a reduced material budget…
This paper covers the main technological and design aspects relevant to the development of a new generation of thin 3D pixel sensors with small pixel size aimed at the High-Luminosity LHC upgrades.
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses…
The phase 1 upgrade of the CMS pixel detector has been designed to maintain the tracking performance at instantaneous luminosities of $2 \times 10^{34} \mathrm{~cm}^{-2} \mathrm{~s}^{-1}$. Both barrel and endcap disk systems now feature one…
The LHC is expected to reach luminosities up to 3000fb-1 and the innermost layer of the ATLAS upgrade plans to cope with higher occupancy and to decrease the pixel size. 3D-Si sensors are a good candidate for the innermost layer of the…
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising candidate to achieve a large area…