Related papers: Transient Multiscale Workflow for Thermal Analysis…
Size-dependence of energy transport and the effects of reduced dimensionality on transport coefficients are of key importance for understanding nonequilibrium properties of matter on the nanoscale. Here, we perform nonequilibrium and…
This paper presents a multiscale methodology for efficient unsteady conjugate heat transfer simulations. The solid domain is modelled by coupling a global representation of the temperature field, based on the eigenfunctions of the unsteady…
A novel microfabricated, all-electrical measurement platform is presented for a direct, accurate and rapid determination of the thermal conductivity and diffusivity of liquid and solid materials. The measurement approach is based on the…
Efficiently capturing the three-dimensional spatiotemporal distributions of temperature is of great significance for alleviating hotspot issues in 3D FinFETs. However, most previous thermal simulations mainly focused on the steady-state…
Compared with silicon (Si) power devices, Silicon carbide (SiC) devices have the advantages of fast switching speed and low on-resistance. However, the effects of non-ideal characteristics of SiC MOSFETs and stray parameters (especially…
The thermal conductivity of thin films is commonly estimated using the 3-omega experimental method. When calibrating the test setup, it is customary to use a specimen with a known thermal conductivity for validation. However, when…
Virtually all electronic systems try to optimize a fundamental trade-off between higher performance and lower power consumption. The latter becomes critical in mobile computing systems, such as smartphones, which rely on passive cooling.…
We introduce a computational framework to statistically infer thermophysical properties of any given wall from in-situ measurements of air temperature and surface heat fluxes. The proposed framework uses these measurements, within a…
A breakthrough in alloy design often requires comprehensive understanding in complex multi-component/multi-phase systems to generate novel material hypotheses. We introduce a modern data analytics workflow that leverages high-quality…
We calibrate a (3+1)-dimensional multistage hybrid framework using the measured pseudo-rapidity distribution of charged particles and rapidity distribution of net protons for central Au+Au collisions at $\sqrt{s_{\rm…
Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerged as a promising…
We present a novel method for reconstructing the thermal conductivity coefficient in 1D and 2D heat equations using moving sensors that dynamically traverse the domain to record sparse and noisy temperature measurements. We significantly…
Existing algorithms with iterations as the principle for 3D inverse heat conduction problems (IHCPs) are usually time-consuming. With the recent advancements in deep learning techniques, it is possible to apply the neural network to compute…
As the size of transistors shrinks and power density increases, thermal simulation has become an indispensable part of the device design procedure. However, existing works for advanced technology transistors use simplified empirical models…
Despite temperature rise being a first-order design constraint, traditional thermal estimation techniques have severe limitations in modeling critical aspects affecting the temperature in modern-day chips. Existing thermal modeling…
Predicting and interpreting thermal performance under oscillating flow in porous structures remains a critical challenge due to the complex coupling between fluid dynamics and geometric features. This study introduces a data-driven…
For the development of nanoscale electronics and photonics using atomically thin two-dimensional (2D) materials, it is important to realize van der Waals (vdW) interfaces with low thermal resistance, to minimize performance reduction caused…
Using nonequilibrium and equilibrium molecular dynamics simulations, we investigate heat conduction in a momentum-conserving mesoscopic fluid modeled by multiparticle collision dynamics. Across quasi-two-dimensional (q-2D) to…
Transient processes generally constitute part of energy-system cycles. If skillfully manipulated, they actually are capable of assisting systems to behave beneficially to suit designers' needs. In the present study, behaviors related to…
Heterogeneous processors with architecturally different cores (CPU and GPU) integrated on the same die lead to new challenges and opportunities for thermal and power management techniques because of shared thermal/power budgets between…