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A comprehensive research framework for a comparative analysis of candidate network architectures and protocols in the clean-slate design of next-generation optical access is proposed. The proposed research framework consists of a…
The transistors used to construct Integrated Circuits (ICs) continue to shrink. While this shrinkage improves performance and density, it also reduces trust: the price to build leading-edge fabrication facilities has skyrocketed, forcing…
Reliability has taken centre stage in the development of high-performance computing processors. A Surge of interest is noticeable in recent times in formulating fault and failure models, understanding failure mechanism and strategizing…
Model-based fault-tolerant control (FTC) often consists of two distinct steps: fault detection & isolation (FDI), and fault accommodation. In this work we investigate posing fault-tolerant control as a single Bayesian inference problem.…
Transparent Conductive Oxides (TCOs) are a class of materials that combine high optical transparency with high electrical conductivity. This property makes them uniquely appealing as transparent-conductive electrodes in solar cells and…
Effects of radiation on electronic circuits used in extra-terrestrial applications and radiation prone environments need to be corrected. Since FPGAs offer flexibility, the effects of radiation on them need to be studied and robust methods…
High-level Autonomous Driving Systems (ADSs), such as Google Waymo and Baidu Apollo, typically rely on multi-sensor fusion (MSF) based approaches to perceive their surroundings. This strategy increases perception robustness by combining the…
Ultrasonic metal welding (UMW) is widely used in industrial applications but is sensitive to tool wear, surface contamination, and material variability, which can lead to unexpected process faults and unsatisfactory weld quality.…
For explainable fault detection and classification (FDC), this paper proposes a unified framework, ABIGX (Adversarial fault reconstruction-Based Integrated Gradient eXplanation). ABIGX is derived from the essentials of previous successful…
Fault diagnosis of general aviation aircraft faces challenges including scarce real fault data, diverse fault types, and weak fault signatures. This paper proposes an intelligent fault diagnosis framework based on multi-fidelity digital…
The growing demand for edge computing and AI drives research into analog in-memory computing using memristors, which overcome data movement bottlenecks by computing directly within memory. However, device failures and variations critically…
The integrated sensing and communication (ISAC) has been envisioned as one representative usage scenario of sixth-generation (6G) network. However, the unprecedented characteristics of 6G, especially the doubly dispersive channel, make…
Adaptive binarization methodologies threshold the intensity of the pixels with respect to adjacent pixels exploiting the integral images. In turn, the integral images are generally computed optimally using the summed-area-table algorithm…
Software testing is becoming a critical part of the development cycle of embedded devices, enabling vulnerability detection. A well-studied approach of software testing is fuzz-testing (fuzzing), during which mutated input is sent to an…
In recent years, there has been a notable surge in attention towards hardware security, driven by the increasing complexity and integration of processors, SoCs, and third-party IPs aimed at delivering advanced solutions. However, this…
As an increasingly powerful technique in integrated photonics, inverse design uses optimization algorithms to automatically create compact, high-performance photonic structures, often yielding non-intuitive layouts far more compact than…
Silicon photonic devices fundamental to high-density wavelength-division multiplexed (DWDM) optical links and photonic switching networks, such as resonant modulators and Mach-Zehnder interferometers (MZIs), are highly sensitive to…
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale…
A large-area thermoelectric generator (TEG) utilizing a folded thin-film concept is implemented and the performance evaluated for near room temperature applications having modest temperature gradients (< 50 K). The TEGs with the area of…
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although reliable, remain costly and difficult to implement for…