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Lattice thermal conductivity (LTC) is a critical parameter for thermal transport properties, playing a pivotal role in advancing thermoelectric materials and thermal management technologies. Traditional computational methods, such as…
A building design aiding tool for space allocation and thermal performance optimization is being developed to help practitioners during the building space planning phase, predicting how it will behave regarding energy consumption and…
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line (BEOL) structures in hot-spot prediction. Multiscale…
The modeling and simulation of heat source trajectories through phase-change materials is a relevant problem both for space exploration and for terrestrial climate research, among other fields. In space, the DLR and NASA are both interested…
The thermal experiments to be carried out onboard LISA Pathfinder (LPF) will provide essential information of the dependences of the instrument with respect to temperature variations. These thermal experiments must be modelled and simulated…
This paper presents review points of mathematical modeling and system identification issues of heat flow process inside a closed box. For system parameter identification, the least squares method is employed and NI Temperature Box is used…
This report details the design and optimisation of a water-cooled forced convection heat dissipation system for use in high-temperature applications (ranges between 700 degrees - 1000 degrees K). A hollow cuboid vapour chamber model was…
Data-driven modeling and control of temperature dynamics in mechatronics systems and industrial processes are challenging control engineering problems. This is mainly because the temperature dynamics is inherently infinite-dimensional,…
Thermal analysis provides deeper insights into electronic chips behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming…
The computer programs most users interact with daily are driven by a graphical user interface (GUI). However, many scientific applications are used with a command line interface (CLI) for the ease of development and increased flexibility…
Conventional pedestrian simulators are inevitable tools in the design process of a building, as they enable project engineers to prevent overcrowding situations and plan escape routes for evacuation. However, simulation runtime and the…
Designing polymers with high intrinsic thermal conductivity (TC) is critically important for the thermal management of organic electronics and photonics. However, this is a challenging task owing to the diversity of the chemical space and…
In this paper, we propose a time-marching multi-level Variational Multiscale-Tensor Decomposition (VMS-TD) algorithm to solve the heat equation with a moving heat source model that arises from additive manufacturing. First, we take a…
TensorFlow is an open-source framework for deep learning dataflow and contains application programming interfaces (APIs) of voice analysis, natural language process, and computer vision. Especially, TensorFlow object detection API in…
We develop an effective medium model of thermal conductivity that accounts for both percolation and interface scattering. This model accurately explains the measured increase and decrease of thermal conductivity with loading in composites…
Understanding puffing topography (PT), which includes puff duration, intra-puff interval, and puff count per session, is critical for evaluating Electronic Nicotine Delivery Systems (ENDS) use, toxicant exposure, and informing regulatory…
A general method for computing derivatives of solution fields and other simulation outputs, with respect to arbitrary input quantities, is proposed. The method of automatic differentiation is used to carry out differentiation and propagate…
This paper deals with a 3D visualization technique proposed to analyze and manage energy efficiency from a data center. Data are extracted from sensors located in the IBM Green Data Center in Montpellier France. These sensors measure…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly…