Related papers: Opportunities and Challenges for 3D Systems and Th…
Over the last decade we have witnessed an increasing use of data processing in embedded systems. Where in the past the data processing was limited (if present at all) to the handling of a small number of "on-off control signals", more…
In this perspective article, we discuss the challenges of imaging assemblies of particles in three dimensions. Starting from a brief motivation for the investigation of particulate materials, we provide an overview of experimental…
The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising…
Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space…
Despite the decades-long history of 3D printing, it is not used to its full potential. Yet 3D printing holds promise for isolated communities, aiming for self-sufficiency. In this experiential study conducted in an analog space habitat we…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
Parallel and monolithic 3D integration directions offer pathways to realize 3D integrated circuits (ICs) but still lead to layer-by-layer implementations, each functional layer being composed in 2D first. This mindset causes challenging…
During the last decade, additive manufacturing has become increasingly popular for rapid prototyping, but has remained relatively marginal beyond the scope of prototyping when it comes to applications with tight tolerance specifications,…
The idea of style similarity metrics has been recently developed for various media types such as 2D clip art and 3D shapes. We explore this style metric problem and improve existing style similarity metrics of 3D shapes in four novel ways.…
To continue scaling beyond 2-D CMOS with 3-D integration, any new 3-D IC technology has to be comparable or better than 2-D CMOS in terms of scalability, enhanced functionality, density, power, performance, cost, and reliability.…
3D Gaussian Splatting (3DGS) has emerged as a prominent technique with the potential to become a mainstream method for 3D representations. It can effectively transform multi-view images into explicit 3D Gaussian through efficient training,…
Accurate physical modeling with 3D-printing techniques could lead to new approaches to study structure and dynamics of biological systems complementing computational methods. Computational biology has become an important part of research…
3D printing enables the fabrication of complex architectures by automating long sequences of additive steps. The increasing sophistication of printers, materials, and generative design promises to make geometric complexity a non-issue in…
Three-dimensional self-assembly of lithographically patterned ultrathin films opens a path to manufacture microelectronic architectures with functionalities and integration schemes not accessible by conventional two-dimensional…
Modern 3D printing technologies and the upcoming mass-customization paradigm call for efficient methods to produce and distribute arbitrarily-shaped 3D objects. This paper introduces an original algorithm to split a 3D model in parts that…
A robust, resource-efficient, distributed, and minimally parameterized 3D map matching and merging algorithm is proposed. The suggested algorithm utilizes tomographic features from 2D projections of horizontal cross-sections of…
Due to the wide diffusion of 3D printing technologies, geometric algorithms for Additive Manufacturing are being invented at an impressive speed. Each single step, in particular along the Process Planning pipeline, can now count on dozens…
To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip…
One of the basic problems in discrete geometry is to determine the most efficient packing of congruent replicas of a given convex set $K$ in the plane or in space. The most commonly used measure of efficiency is density. Several types of…
Growing interest in semiconductor workforce development has generated demand for platforms capable of supporting large numbers of independent hardware designs for research and training without imposing high per-project overhead. Traditional…