Related papers: CMOS 2.0 -- Redefining the Future of Scaling
Photonics has been one of the primary beneficiaries of advanced silicon manufacturing. By leveraging on mature complementary metal-oxide-semiconductor (CMOS) process nodes, unprecedented device uniformities and scalability have been…
Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in…
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…
With the increasing digital services demand, performance and power-efficiency become vital requirements for digital circuits and systems. However, the enabling CMOS technology scaling has been facing significant challenges of device…
As transistor scaling approaches its fundamental physical limits in the Angstrom era, two-dimensional (2D) semiconductors have emerged as the promising channel material candidates for future computing. While the device physics of 2D…
The Network on Chip (NoC) paradigm is rapidly replacing bus based System on Chip (SoC) designs due to their inherent disadvantages such as non-scalability, saturation and congestion. Currently very few tools are available for the simulation…
Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D…
Stacked intelligent metasurfaces (SIMs) have recently emerged as an effective solution for next-generation wireless networks. A SIM comprises multiple metasurface layers that enable signal processing directly in the wave domain. Moreover,…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
Scaling neural network models has delivered dramatic quality gains across ML problems. However, this scaling has increased the reliance on efficient distributed training techniques. Accordingly, as with other distributed computing…
Neuromorphic systems open up opportunities to enlarge the explorative space for computational research. However, it is often challenging to unite efficiency and usability. This work presents the software aspects of this endeavor for the…
As spatial and temporal resolutions of scientific instruments improve, the explosion in the volume of data produced is becoming a key challenge. It can be a critical bottleneck for integration between scientific instruments at the edge and…
We propose energy-saving fast-forward scaling. Fast-forward scaling is a method which enables us to speed up (or slow down) given dynamics in a certain measurement basis. We introduce energy costs of fast-forward scaling, and find…
Medical image segmentation takes an important position in various clinical applications. 2.5D-based segmentation models bridge the computational efficiency of 2D-based models with the spatial perception capabilities of 3D-based models.…
Smart grid technological advances present a recent class of complex interdisciplinary modeling and increasingly difficult simulation problems to solve using traditional computational methods. To simulate a smart grid requires a systemic…
Stacked intelligent metasurfaces (SIMs) have recently gained attention as a paradigm for wave-domain signal processing with reduced reliance on costly radio-frequency (RF) chains. However, conventional SIMs rely on uniform inter-layer…
Inverse design coupled with adjoint optimization is a powerful method to design on-chip nanophotonic devices with multi-wavelength and multi-mode optical functionalities. Although only two simulations are required in each iteration of this…
In this paper, we consider the joint design of data compression and 802.15.4-based medium access control (MAC) protocol for smartgrids with renewable energy. We study the setting where a number of nodes, each of which comprises electricity…
Future complementary metal oxide semiconductor (CMOS) scaling for advanced integrated circuit (IC) technologies may well depend on "More than Moore" (MtM) approaches using heterogeneous integration of semiconductor-based devices. In order…
There are increasing number of works addressing the design challenges of fast, scalable solutions for the growing number of new type of applications. Recently, many of the solutions aimed at improving processing element capabilities to…