Related papers: 3D Electronic-Photonic Heterogenous Interconnect P…
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale…
Compact and robust waveguide chips are crucial for new integrated terahertz applications, such as high-speed interconnections between processors and broadband short-range wireless communications. Progress on topological photonic crystals…
Leveraging the quantum information processing ability of superconducting circuits and long-distance distribution ability of optical photons promises the realization of complex and large-scale quantum networks. In such a scheme, a coherent…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
Modern integrated circuits are essentially two-dimensional (2D). Partial three-dimensional (3D) integration and 3D-transistor-level integrated circuits have long been anticipated as routes to improve the performance, cost and size of…
To meet the ambitious goals of next-generation 6G networks, including ultra-high data rates and ubiquitous coverage, we propose a novel high-altitude platform station (HAPS)-based integrated sensing and communication (ISAC) architecture.…
High-dimensional quantum entanglement is an important resource for emerging quantum technologies such as quantum communication and quantum computation. The scalability of metres-long experimental setups limits high-dimensional entanglement…
Photonic platforms represent a promising technology for the realization of several quantum communication protocols and for experiments of quantum simulation. Moreover, large-scale integrated interferometers have recently gained a relevant…
Optimizing iPIC3D, an implicit Particle-in-Cell (PIC) code, for large-scale 3D plasma simulations is crucial for space and astrophysical applications. This work focuses on characterizing iPIC3D's communication efficiency through strategic…
Multichip systems with memory stacks and various processing chips are at the heart of platform based designs such as servers and embedded systems. Full utilization of the benefits of these integrated multichip systems need a seamless, and…
Complex photonic integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the…
Optoelectronic signal processing offers great potential for generation and detection of ultra-broadband waveforms in the THz range, so-called T-waves. However, fabrication of the underlying high-speed photodiodes and photoconductors still…
In recent years, with the rise of artificial intelligence and big data, there is an even greater demand for scaling out computing and memory capacity. Silicon interconnect fabric (Si-IF), a wafer-scale integration platform, promotes a…
Silicon photonics is a leading platform for realizing the vast numbers of physical qubits needed for useful quantum information processing because it leverages mature complementary metal-oxide-semiconductor (CMOS) manufacturing to integrate…
Interlayer excitons in two dimensional semiconductor heterostructures show suppressed electron-hole overlap resulting in longer radiative lifetimes as compared to intralyer excitons. Such tightly bound interlayer excitons are relevant for…
Multi-chiplet architectures enabled by glass interposer offer superior electrical performance, enable higher bus widths due to reduced crosstalk, and have lower capacitance in the redistribution layer than current silicon interposer-based…
In optical communication systems, fibre nonlinearity is the major obstacle in increasing the transmission capacity. Typically, digital signal processing techniques and hardware are used to deal with optical communication signals, but…
Interface interactions in 2D vertically stacked heterostructures play an important role in optoe-lectronic applications, photodetectors based on graphene/InSe heterostructures had shown promising performance nowadays. However, nonlinear…
Deep learning has led to unprecedented successes in solving some very difficult problems in domains such as computer vision, natural language processing, and general pattern recognition. These achievements are the culmination of…
Integrated photonics capable of incorporating rare earth ions with high optical coherence is desirable for realizing efficient quantum transducers, compact quantum memories, and hybrid quantum systems. Here we describe a photonic platform…