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Integrated photonic technologies are rapidly becoming an important and fundamental milestone for wideband optical telecommunications. Future optical networks have several critical requirements, including low energy consumption, high…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
The explosion of artificial intelligence and machine-learning algorithms, connected to the exponential growth of the exchanged data, is driving a search for novel application-specific hardware accelerators. Among the many, the photonics…
The rapid expansion of generative AI drives unprecedented demands for high-performance computing. Training large-scale AI models now requires vast interconnected GPU clusters across multiple data centers. Multi-scale AI training and…
Photonic integrated circuits (PICs) are crucial for advancing optical communications, promising substantial gains in data transmission speed, bandwidth, and energy efficiency compared to conventional electronics. Telecom-wavelength…
Main memories play an important role in overall energy consumption of embedded systems. Using conventional memory technologies in future designs in nanoscale era causes a drastic increase in leakage power consumption and temperature-related…
High-speed signal processing is essential for maximizing data throughput in emerging communication applications, like multiple-input multiple-output (MIMO) systems and radio-frequency (RF) interference cancellation. However, as these…
The explosive growth of artificial intelligence, cloud computing, and large-scale machine learning is driving an urgent demand for short-reach optical interconnects featuring large bandwidth, low power consumption, high integration density,…
Silicon nitride (Si$_3$N$_4$) photonic integrated circuits (PICs) have emerged as a versatile platform for a wide range of applications, such as nonlinear optics, narrow-linewidth lasers, and quantum photonics. While thin-film Si$_3$N$_4$…
Stacked intelligent metasurface (SIM), which consists of multiple layers of intelligent metasurfaces, is emerging as a promising solution for future wireless communication systems. In this timely context, we focus on broadcast…
The exponential growth of machine-intelligence workloads is colliding with the power, memory, and interconnect limits of the post-Moore era, motivating compute substrates that scale beyond transistor density alone. Integrated photonics is…
Photonic integrated circuits (PICs) directly written with a femtosecond laser have shown great potential in many areas such as quantum information processing (QIP). Many applications, like photon-based quantum computing, demand the…
With high integration density and excellent optical properties, silicon photonics is becoming a promising platform for complete integration and large-scale optical quantum information processing. Scalable quantum information applications…
Visible-spectrum photonic integrated circuits (PICs) present compact and scalable solutions for emerging technologies including quantum computing, biosensing, and virtual/augmented reality. Realizing their full potential requires the…
The stringent demands of photonic quantum computing protocols motivate photonic integrated circuit (PIC) platforms with passive optical properties such as extremely low losses and correspondingly large circuit depths, as well as active…
Heterogeneous integration of gain and strongly nonlinear materials with ultra-low-loss silicon nitride (SiN) photonics offers a route to scalable quantum circuits, but concurrent wafer-scale manufacturability, low interlayer loss, and high…
Heterogeneous chiplets have been proposed for accelerating high-performance computing tasks. Integrated inside one package, CPU and GPU chiplets can share a common interconnection network that can be implemented through the interposer.…
3GPP LTE-Advanced has started a new study item to investigate Heterogeneous Network (HetNet) deployments as a cost effective way to deal with the unrelenting traffic demand. HetNets consist of a mix of macrocells, remote radio heads, and…
Holographic multiple-input multiple-output (MIMO) has emerged as a key enabler for 6G networks, yet conventional planar implementations suffer from spatial correlation and mutual coupling at sub-wavelength spacing, which fundamentally limit…
In the past decade, photonic integrated circuits (PICs) based on thin-film lithium niobate (TFLN) have advanced in various fields, including optical communication, nonlinear photonics, and quantum optics. A critical component is an…