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Photonic waveguides are prime candidates for integrated and parallel photonic interconnects. Such interconnects correspond to large-scale vector matrix products, which are at the heart of neural network computation. However, parallel…
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), the resulting complexity and manufacturing challenges continue…
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks,…
Integrated photonics has profoundly impacted a wide range of technologies underpinning modern society. The ability to fabricate a complete optical system on a chip offers unrivalled scalability, weight, cost and power efficiency. Over the…
Three-dimensional (3D) photonic integration offers a pathway to overcome the fundamental scaling limitations of planar platforms by enabling enhanced routing flexibility for compact, low-loss, and highly interconnected photonic circuits. In…
Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly,…
In recent decades, the demand for computational power has surged, particularly with the rapid expansion of artificial intelligence (AI). As we navigate the post-Moore's law era, the limitations of traditional electrical digital computing,…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional photonic integration have emerged as promising…
The future of artificial intelligence (AI) acceleration demands a paradigm shift beyond the limitations of purely electronic or photonic architectures. Photonic analog computing delivers unmatched speed and parallelism but struggles with…
As data rates for multi-gigabit serial interfaces within multi-node compute systems approach and exceed 10 Gigabits per second (Gbps), board-to-board and chip-to-chip optical signaling solutions become more attractive, particularly for…
Integrated photonics offers great potential for quantum communication devices in terms of complexity, robustness and scalability. Silicon photonics in particular is a leading platform for quantum photonic technologies, with further benefits…
Energy efficiency of electronic digital processors is primarily limited by the energy consumption of electronic communication and interconnects. The industry is almost unanimously pushing towards replacing both long-haul, as well as local…
Electronic-photonic integrated circuits (EPICs) offer transformative potential for next-generation high-performance AI but require interdisciplinary advances across devices, circuits, architecture, and design automation. The complexity of…
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
The recent progress in chip-scale integrated photonics has stimulated the rapid development of material platforms with desired optical properties. Among the different material platforms that are currently investigated, the third-generation…
Optical I/O technologies have emerged as a potential industrial solution for high-performance data interconnection in AI/ML computing acceleration. While optical I/Os are deployed at the edge of computational chips by co-packaged optics…
High-fidelity control of the thousands to millions of programmable qubits needed for utility-scale quantum computers presents a formidable challenge for control systems. In leading atomic systems, control is optical: UV-NIR beams must be…
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, scaling to sub-20nm technologies is proving to be challenging as MOSFETs are…
Dielectric optical waveguides constitute the main building blocks of photonic integrated circuits (PICs). Channels with high refractive index contrast can provide very compact PIC components whereas structures with lower index exhibit less…