English

Comparison of Optical and Electrical Links for Highly-Interconnected Systems

Signal Processing 2023-01-25 v1

Abstract

As data rates for multi-gigabit serial interfaces within multi-node compute systems approach and exceed 10 Gigabits per second (Gbps), board-to-board and chip-to-chip optical signaling solutions become more attractive, particularly for longer (e.g. 50-100 cm) links. The transition to optical signaling will potentially allow new high performance compute (HPC) system architectures that benefit from characteristics unique to optical links. To examine these characteristics, we built and tested several optical demonstration vehicles; one based on dense wavelength division multiplexing (DWDM), and others based on multiple point-to-point links carried across multimode fibers. All test vehicles were constructed to evaluate applicability to a multi-node compute system. Test results, combined with data from recent research efforts are summarized and compared to equivalent electrical links and the advantages and design characteristics unique to optical signaling are identified.

Keywords

Cite

@article{arxiv.2301.10169,
  title  = {Comparison of Optical and Electrical Links for Highly-Interconnected Systems},
  author = {James Kruchowski and Vladimir Sokolov and Nathan E. Harff and Mark A. Nelson and KY Liou and Graham Cameron and Barry K. Gilbert and Erik S. Daniel},
  journal= {arXiv preprint arXiv:2301.10169},
  year   = {2023}
}

Comments

25 pages, 18 figures, DesignCon 2011

R2 v1 2026-06-28T08:18:53.733Z