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Data-driven intelligent computational design (DICD) is a research hotspot emerged under the context of fast-developing artificial intelligence. It emphasizes on utilizing deep learning algorithms to extract and represent the design features…
Digital Twin (DT) technology revolutionizes industrial processes by enabling the representation of physical entities and their dynamics to enhance productivity and operational efficiency. It has emerged as a vital enabling technology in the…
Despite rapid evolution, embedded computing systems increasingly feature resource constraints and workload uncertainties. To achieve much better system performance in unpredictable environments than traditional design approaches, a novel…
Patent data have long been used for engineering design research because of its large and expanding size, and widely varying massive amount of design information contained in patents. Recent advances in artificial intelligence and data…
Given the ever-increasing advances of digital microfluidic biochips and their application in a wide range of areas including bio-chemistry experiments, diagnostics, and monitoring purposes like air and water quality control and etc.,…
Fast-evolving artificial intelligence (AI) algorithms such as large language models have been driving the ever-increasing computing demands in today's data centers. Heterogeneous computing with domain-specific architectures (DSAs) brings…
The purpose of this paper is to fill a gap in the general understanding -- and academic scrutiny -- of current and emerging workflows for designing and fabricating integrated circuits. The approach is to compare the IC design workflow with…
The ongoing process of smart grid digitalisation is increasing the volume of automated information exchange across distributed energy systems. This has driven the development of new information and data models when existing models fail to…
Recent breakthroughs in Large Language Models (LLMs) and Large Circuit Models (LCMs) have sparked excitement across the electronic design automation (EDA) community, promising a revolution in circuit design and optimization. Yet, this…
Digital twins promise a better understanding and use of complex systems. To this end, they represent these systems at their runtime and may interact with them to control their processes. Software engineering is a wicked challenge in which…
This survey explores the integration of machine learning (ML) into EDA workflows for analog and RF circuits, addressing challenges unique to analog design, which include complex constraints, nonlinear design spaces, and high computational…
Workflow technology is rapidly evolving and, rather than being limited to modeling the control flow in business processes, is becoming a key mechanism to perform advanced data management, such as big data analytics. This survey focuses on…
Benchmarking and co-design are essential for driving optimizations and innovation around ML models, ML software, and next-generation hardware. Full workload benchmarks, e.g. MLPerf, play an essential role in enabling fair comparison across…
The growing IC complexity has led to a compelling need for design efficiency improvement through new electronic design automation (EDA) methodologies. In recent years, many unprecedented efficient EDA methods have been enabled by machine…
The recent advancement of information and communication technology makes digitalisation of an entire manufacturing shop-floor possible where physical processes are tightly intertwined with their cyber counterparts. This led to an emergence…
Large Language Models have emerged as powerful tools for automating Register-Transfer Level (RTL) code generation, yet they face critical limitations: existing approaches typically fail to simultaneously optimize functional correctness and…
Exploiting the recent advancements in artificial intelligence, showcased by ChatGPT and DALL-E, in real-world applications necessitates vast, domain-specific, and publicly accessible datasets. Unfortunately, the scarcity of such datasets…
Three-dimensional integrated circuit (3D IC) pack-aging and heterogeneous integration have emerged as central pillars of contemporary semiconductor scaling. Yet, the multi-physics coupling inherent to stacked architectures manifesting as…
Digital twin (DT) technology has received immense attention over the years due to the promises it presents to various stakeholders in science and engineering. As a result, different thematic areas of DT have been explored. This is no…
Microelectronics development is critical to a wide number of DOE projects and mission space. Creating Helpful Incentives to Produce Semiconductors (CHIPS) and manufacturing Application Specific Integrated Circuits (ASIC) are important to…