Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies

Gabriella Carini; Marcel Demarteau; Peter Denes; Angelo Dragone; Farah Fahim; Carl Grace; Shaorui Li; F Mitch Newcomer; Brianna Yi

Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies

Physics and Society 2022-03-18 v1

Authors: Gabriella Carini , Marcel Demarteau , Peter Denes , Angelo Dragone , Farah Fahim , Carl Grace , Shaorui Li , F Mitch Newcomer , Brianna Yi

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Abstract

Microelectronics development is critical to a wide number of DOE projects and mission space. Creating Helpful Incentives to Produce Semiconductors (CHIPS) and manufacturing Application Specific Integrated Circuits (ASIC) are important to DOE, so the infrastructure that allows DOE to carry out its mission needs to exist. This paper discusses the current initiatives and recommends a business model to build an ecosystem for microelectronics design for DOE which includes three main building blocks: the Computer Aided Design (CAD) - Electronic Design Automation (EDA) design tools, basic design IPs, and access to semiconductor fabrication facilities.

Keywords

microelectronics high energy physics cad companies eda tools asic chips act fabrication access

Cite

@article{arxiv.2203.08973,
  title  = {Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies},
  author = {Gabriella Carini and Marcel Demarteau and Peter Denes and Angelo Dragone and Farah Fahim and Carl Grace and Shaorui Li and F Mitch Newcomer and Brianna Yi},
  journal= {arXiv preprint arXiv:2203.08973},
  year   = {2022}
}

Big Industry Engagement to Benefit HEP: Microelectronics Support from Large CAD Companies

Abstract

Keywords

Cite

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