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Author offers and researches a new idea - filling tubes by electronic gases. He shows: If the insulating envelope (cover) of the tube is charged positively, the electrons within the tube are not attracted to covering. Tube (as a whole)…
This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient…
Thermoelectric devices are heat engines, which operate as generators or refrigerators using the conduction electrons as a working fluid. The thermoelectric heat-to-work conversion efficiency has always been typically quite low, but much…
A mechanism of electron-mediated pumping of heat in the absence of net charge transfer is proposed. It may be realized in charge-neutral electron systems, such as graphene, coupled to an external electric potential. The flow of heat in this…
In MEMS technology, most of the devices are fabricated on glass or silicon substrate. However, this research presents a novel manufacture method that is derived from conventional hot embossing technology to fabricate the electrostatic…
Adapting electronics to perfectly conform to non-planar and rough surfaces, such as human skin, is a very challenging task which, if solved, could open up new applications in fields of high economic and scientific interest ranging from…
It is widely agreed that phase change materials (PCMs) are of high interest for sustainable energy future. Many of the applications require anti-leakage properties of PCM, that can be accomplished through PCM encapsulation. In this study,…
A new homogenization-free boundary condition is introduced for the design of metasurfaces. The boundary condition, linking the tangential electric field to the induced surface current density within a unit cell, is described as a matrix…
Controlled breakdown has recently emerged as a highly accessible technique to fabricate solid-state nanopores. However, in its most common form, controlled breakdown creates a single nanopore at an arbitrary location in the membrane. Here,…
Rigorous computer simulations of propagating electromagnetic fields have become an important tool for optical metrology and optics design of nanostructured components. As has been shown in previous benchmarks some of the presently used…
Fourier solvers have become efficient tools to establish structure-property relations in heterogeneous materials. Introduced as an alternative to the Finite Element (FE) method, they are based on fixed-point solutions of the…
A thermal position sensor was fabricated and evaluated. The device consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A novel fabrication technology was implemented which allows direct…
This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular…
The proper generalized decomposition is applied to a static electrothermal model subject to uncertainties. A reduced model that circumvents the curse of dimensionality is obtained. The quadratic electrothermal coupling term is non-standard…
Although recent advancements in learning-based analog circuit design automation have tackled tasks such as topology generation, device sizing, and layout synthesis, efficient performance evaluation remains a major bottleneck. Traditional…
Modern electronic systems become evermore complex, yet remain modular, with integrated circuits (ICs) acting as versatile hardware components at their heart. Electronic design automation (EDA) for ICs has focused traditionally on power,…
In this paper we present an advanced numerical method to simulate a real life challenging industrial problem that consists of the non-destructive testing in steam generators. We develop a finite element technique that handles the big data…
Additive manufacturing, or 3D printing, is a complex process that creates free-form geometric objects by sequentially placing material to construct an object, usually in a layer-by-layer process. One of the most widely used methods is Fused…
We introduce SPAFormer, an innovative model designed to overcome the combinatorial explosion challenge in the 3D Part Assembly (3D-PA) task. This task requires accurate prediction of each part's poses in sequential steps. As the number of…
Superconducting diodes enable dissipationless directional transport, yet achieving electrical tunability and scalability remains a major challenge for circuit-level integration. Here, we demonstrate an electrothermal-switch superconducting…