Related papers: EMSpice 2.1: A Coupled EM and IR Drop Analysis Too…
This paper presents EMSpice~3, a full-chip multiphysics framework for coupled electromigration (EM), thermomigration (TM), and IR-drop analysis of practical power-grid (P/G) networks. The framework is, to our knowledge, the first EM-IR…
Reliability is a fundamental requirement in any microprocessor to guarantee correct execution over its lifetime. The design rules related to reliability depend on the process technology being used and the expected operating conditions of…
Electromigration, a significant lifetime reliability concern in highperformance integrated circuits, is projected to grow even more important in future heterogeneously integrated systems that will service higher current loads. Today, EM…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
Computationally expensive temperature and power grid analyses are required during the design cycle to guide IC design. This paper employs encoder-decoder based generative (EDGe) networks to map these analyses to fast and accurate…
As modern analogue/mixed-signal design increasingly relies on optimization-in-the-loop flows, such as AI and LLM-based sizing agents that repeatedly invoke SPICE-efficient, accurate high-performance simulators have become an indispensable…
We numerically and experimentally investigate evaporation of a sessile droplet on a heated substrate. We develop a finite element (FE) model in two-dimensional axisymmetric coordinates to solve coupled transport of heat in the droplet and…
Based on simplified one-dimensional steady-state analysis of thermoelectric phenomena and on analogies between thermal and electrical domains, we propose both lumped and distributed parameter electrical models for thermoelectric devices.…
In this paper, we briefly introduce physical foundations of electromigration (EM) and present a few classical EMrelated theories. We discuss physical parameters affecting EM wire lifetime and we introduce some background related to the…
Structural system identification in the presence of thermal loads is challenging, as unmeasured or poorly modeled thermal effects can mask or mimic damage, leading to unreliable conclusions. This work presents an optimization-driven,…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
Thermal transport in nanostructures plays a critical role in modern technologies. As devices shrink, techniques that can measure thermal properties at nanometer and nanosecond scales are increasingly needed to capture transient,…
Energy management systems (EMS) rely on (non)-intrusive load monitoring (N)ILM to monitor and manage appliances and help residents be more energy efficient and thus more frugal. The robustness as well as the transfer potential of the most…
As semiconductor scaling reaches the A16 / 2 nm node, the integration of co-packaged optics (CPO) via TSMC's Co-Packaged Optics Ultra Engine (COUPE) architecture introduces critical thermal-optical coupling challenges. Micro-ring resonators…
Electromagnetic Fault Injection (EMFI) is a powerful technique for inducing bit flips and instruction-level perturbations on microcontrollers, yet existing literature lacks a unified methodology for systematically mapping spatial…
Surface tension and contact angle measurements are fundamental characterization techniques relevant to thermal and fluidic applications. Drop shape analysis techniques for the measurement of interfacial tension are powerful, versatile and…
Understanding microstructural evolution under extreme thermal conditions is essential for advancing metal additive manufacturing (AM). This work demonstrates the feasibility of employing micro-electro-mechanical system (MEMS) heating…
Recent embedded systems are designed with high-performance System-on-Chips (SoCs) to satisfy the computational needs of complex applications widely used in real life, such as airplane controllers, autonomous driving automobiles, medical…
We report on the application of a feedback-controlled electromigration technique for the formation of nanometer-sized gaps in mesoscopic gold wires and rings. The effect of current density and temperature, linked via Joule heating, on the…
Real-time multimodal inference on resource-constrained edge devices is essential for applications such as autonomous driving, human-computer interaction, and mobile health. However, prior work often overlooks the tight coupling between…