Related papers: Analysis of a 3D Integrated Superconducting Quantu…
As the field of superconducting quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is…
Three-dimensional integration technologies such as flip-chip bonding are a key prerequisite to realize large-scale superconducting quantum processors. Modular architectures, in which circuit elements are spread over multiple chips, can…
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the…
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and contamination rules on 200 mm wafers. We present the utilized…
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged…
One of the most crucial steps in creating practical quantum computers is designing scalable and efficient superconducting qubits. Coherence times, connections between individual qubits, and reduction of environmental noise are critical…
We report high qubit coherence as well as low crosstalk and single-qubit gate errors in a superconducting circuit architecture that promises to be tileable to 2D lattices of qubits. The architecture integrates an inductively shunted cavity…
In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting…
As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is…
Of the many potential hardware platforms, superconducting quantum circuits have become the leading contender for constructing a scalable quantum computing system. All current architecture designs necessitate a 2D arrangement of…
As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In…
Three-dimensional device integration facilitates the construction of superconducting quantum information processors with more than several tens of qubits by distributing elements such as control wires, qubits, and resonators between…
A promising way to store quantum information is by encoding it in the bosonic excitations of microwave resonators. This provides for long coherence times, low dephasing rates, as well as a hardware-efficient approach to quantum error…
InductEx is a software tool used for the analysis of integrated circuit designs and extraction of design parameters by way of numerical electromagnetic field solving. This tool was originally developed with Rapid Single Flux Quantum (RSFQ)…
Qubit coherence and gate fidelity are typically considered the two most important metrics for characterizing a quantum processor. An equally important metric is inter-qubit connectivity as it minimizes gate count and allows implementing…
Superconducting enclosures will be key components of scalable quantum computing devices based on circuit quantum electrodynamics (cQED). Within a densely integrated device, they can protect qubits from noise and serve as quantum memory…
Microwave filtering for superconducting qubits is a key element of quantum computing technology, enabling high coherence and fast state detection. This work presents the design and implementation of novel microwave Purcell filters for…
We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on…
We assess independently the impact of high-temperature substrate annealing and metal deposition conditions on the coherence of transmon qubits in the standard 2D circuit-QED architecture. We restrict our study to devices made with aluminum…
We report on the fabrication and metrology of superconducting caps for qubit circuits. As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum…