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Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to…

This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…

In recent years, the role of crystal symmetries in enriching the variety of TIs have been actively investigated. Higher-order TIs are a new type of topological crystalline insulators that exhibit gapless boundary states whose dimensionality…

3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Bandwidth Memory (HBM). However, the copper-based electrical…

2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a high traffic load on the interposer network. Silicon photonics…

Nonlinear photonic chips have succeeded in generating and processing signals all-optically with performance far superior to that possible electronically - particularly with respect to speed. Although silicon-on-insulator has been the…

The current zero trust model adopted in System-on-Chip (SoC) design is vulnerable to various malicious entities, and modern SoC designs must incorporate various security policies to protect sensitive assets from unauthorized access. These…

Heterogeneous chiplets have been proposed for accelerating high-performance computing tasks. Integrated inside one package, CPU and GPU chiplets can share a common interconnection network that can be implemented through the interposer.…

Topological insulator (TI) materials are exciting candidates for integration into next-generation memory and logic devices because of their potential for efficient, low-energy-consumption switching of magnetization. Specifically, the family…

2D topological insulators promise novel approaches towards electronic, spintronic, and quantum device applications. This is owing to unique features of their electronic band structure, in which bulk-boundary correspondences enforces the…

The ability to manipulate or separate a biological small particle, such as a living cell and embryo, is fundamental needed to many biological and medical applications. The insulator-based dielectrophoresis (iDEP) trapping is composed of…

Optical Circuit Switching (OCS) technology is increasingly being adopted in data centers due to its advantages of low power consumption and low technology refresh costs. Unlike electrical packet switches, OCS provides programmable bandwidth…

Manycore System-on-Chip include an increasing amount of processing elements and have become an important research topic for improvements of both hardware and software. While research can be conducted using system simulators, prototyping…

Introducing, observing, and manipulating individual impurities coupled to a host material offers the opportunity to create new device concepts based on single spin and charge states. Because of potential applications in spintronics and…

Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly growing deep neural network (DNN) models. Chiplet-based…

Catenanes as interlocked molecules with a nonplanar graph have gained increasing attention for their unique features such as topological chirality. To date, the majority of research in this field has been focusing on catenanes comprising…

Introducing uniform magnetic order in two-dimensional topological insulators (2D TIs) by constructing heterostructures of TI and magnet is a promising way to realize the high-temperature Quantum Anomalous Hall effect. However, the…

Topological insulators (TIs) are materials with unique surface conductive properties that distinguish them from normal insulators and have attracted significant interest due to their potential applications in electronics and spintronics.…

The mathematical field of topology has become a framework to describe the low-energy electronic structure of crystalline solids. A typical feature of a bulk insulating three-dimensional topological crystal are conducting two-dimensional…

Topological Interlocking Structures (TIS) are assemblies of interlocking building blocks that hold together solely through contact and friction at the blocks' interfaces, and thus do not require any connective elements. This salient feature…