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To incorporate the computation and communication with the physical world, next generation architecture i.e. CPS is viewed as a new technology. To improve the better interaction with the physical world or to perk up the electricity delivery…
Dedicated, after acceptance and publication, in memory of the late Vassos Soteriou. For the first time, we leverage the 2.5D interposer technology to establish system-level security in the face of hardware- and software-centric adversaries.…
By interconnecting smaller chiplets through an interposer, 2.5D integration offers a cost-effective and high-yield solution to implement large-scale modular systems. Nevertheless, the underlying network is prone to deadlock, despite…
Achieving high performance, energy efficiency, and cost-effectiveness while maintaining architectural flexibility is a critical challenge in the development and deployment of edge AI devices. Monolithic SoC designs struggle with this…
The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to convert such flexibility into cost efficiency, which is…
The success of topological insulators (TI) in creating devices with unique functionalities is directly connected to the ability of coupling their helical spin states to well defined perturbations. However, up to now, TI-based…
Photonic integrated circuits that exploit nonlinear optics in order to generate and process signals all-optically have achieved performance far superior to that possible electronically - particularly with respect to speed. Although…
We present a roadmap for open-source chiplet-based RISC-V systems targeting high-performance computing and artificial intelligence, aiming to close the performance gap to proprietary designs. Starting with Occamy, the first open,…
Torus networks of moderate degree have been widely used in the supercomputer industry. Tori are superb when used for executing applications that require near-neighbor communications. Nevertheless, they are not so good when dealing with…
To address increasing compute demand from recent multi-model workloads with heavy models like large language models, we propose to deploy heterogeneous chiplet-based multi-chip module (MCM)-based accelerators. We develop an advanced…
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-scale VLSI systems with higher energy efficiency in data…
Commonly materials are classified as either electrical conductors or insulators. The theoretical discovery of topological insulators (TIs) in 2005 has fundamentally challenged this dichotomy. In a TI, spin-orbit interaction generates a…
Topological insulators (TIs) are a recently discovered class of materials having insulating bulk electronic states but conducting boundary states distinguished by nontrivial topology. So far, several generations of TIs have been…
Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of…
Vision Transformers (ViTs) have established new performance benchmarks in vision tasks such as image recognition and object detection. However, these advancements come with significant demands for memory and computational resources,…
Chirality, a fundamental property of asymmetric structures, plays a crucial role in pharmaceutical, biological and chemical systems, offering a powerful tool for screening organic compounds. While the conventional optical chirality…
Chip industry continues advancing and expanding modern computing systems, resulting in more complex multi-core processors. Conversely, academic projects face scalability challenges due to limited resources, highlighting the need for…
The exponential growth of AI has created unprecedented demand for computational resources, pushing chip designs to the limit while simultaneously escalating the environmental footprint of computing. As the industry transitions toward…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
Recently, hardware technology has rapidly evolved pertaining to domain-specific applications/architectures. Soon, processors may be composed of a large collection of vendor-independent IP specialized for application-specific algorithms,…