Related papers: Fast Thermal-Aware Chiplet Placement Assisted by S…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integration. As chiplet counts grow, traditional placement tools,…
The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and more heterogeneous chiplet assemblies. Existing placement…
Algorithms for simulating complex physical systems or solving difficult optimization problems often resort to an annealing process. Rather than simulating the system at the temperature of interest, an annealing algorithm starts at a…
The method of simulated annealing is adapted to the temperature-emissivity separation (TES) problem. A patch of surface at the bottom of the atmosphere is assumed to be a greybody emitter with spectral emissivity $\epsilon(k)$ describable…
Simulated annealing is an effective and general means of optimization. It is in fact inspired by metallurgy, where the temperature of a material determines its behavior in thermodynamics. Likewise, in simulated annealing, the actions that…
As one of the most robust global optimization methods, simulated annealing has received considerable attention, with many variations that attempt to improve the cooling schedule. This paper introduces a variant of simulated annealing that…
Reducing energy consumption and carbon emissions in data centers by enabling real-time temperature prediction is critical for sustainability and operational efficiency. Achieving this requires accurate modeling of the 3D temperature field…
Global optimization heuristics are popular to optimize hard non-convex problems. Despite their irrefutably large cost-to-solution, in the lack of other working greedy or convex approaches, global optimization algorithms remain the…
Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach their limits. Heterogeneous integration of smaller chiplets…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
Numerical simulations on mobile devices are an important tool for engineers and decision makers in the field. However, providing simulation results on mobile devices is challenging due to the complexity of the simulation, requiring remote…
Finding the global minimum in a rugged potential landscape is a computationally hard task, often equivalent to relevant optimization problems. Simulated annealing is a computational technique which explores the configuration space by…
Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workloads. Processing-in-Memory (PIM) has emerged as a promising…
Data assimilation is the process of fusing information from imperfect computer simulations with noisy, sparse measurements of reality to obtain improved estimates of the state or parameters of a dynamical system of interest. The data…
Climate control of buildings makes up a significant portion of global energy consumption, with groundwater heat pumps providing a suitable alternative. To prevent possibly negative interactions between heat pumps throughout a city, city…
In the last few years, energy efficiency has become a challenge. Not only mitigating environmental impact but reducing energy waste can lead to financial advantages. Buildings play an important role in this: they are among the biggest…
Chiplet-based systems have gained significant attention in recent years due to their low cost and competitive performance. As the complexity and compactness of a chiplet-based system increase, careful consideration must be given to…
High-density through-substrate vias (TSVs) enable 2.5D/3D heterogeneous integration but introduce significant signal-integrity and thermal-reliability challenges due to electrical coupling, insertion loss, and self-heating. Conventional…