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Recently, surrogate models based on deep learning have attracted much attention for engineering analysis and optimization. As the construction of data pairs in most engineering problems is time-consuming, data acquisition is becoming the…
Power modules with excellent inductance and temperature metrics are significant to meet the rising sophistication of energy demand in new technologies. In this paper, we use a surrogate-based approach to render optimal layouts of power…
The high dissipation of integrated circuits means serious problems for packaging and for the design of complex electronic systems. Another important area of research and development nowadays is the integration of sensors and micromechanical…
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents several drawbacks that prevent its smooth application. Two of the…
Deep convolutional neural networks have demonstrated promising performance on image classification tasks, but the manual design process becomes more and more complex due to the fast depth growth and the increasingly complex topologies of…
The ability for groundwater heat pumps to meet space heating and cooling demands without relying on fossil fuels, has prompted their mass roll out in dense urban environments. In regions with high subsurface groundwater flow rates, the…
While the prediction of AC losses during transients is critical for designing large-scale low-temperature superconducting (LTS) magnets, brute-force finite-element (FE) simulation of their detailed geometry down to the length scale of the…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
Time-dependent deformation, particularly creep, in high-temperature alloys such as Inconel 625 is a key factor in the long-term reliability of components used in aerospace and energy systems. Although Inconel 625 shows excellent creep…
We introduce a new update scheme to systematically improve the efficiency of parallel tempering simulations. We show that by adapting the number of sweeps between replica exchanges to the canonical autocorrelation time, the average…
Simulation of a quantum many-body system at finite temperatures is crucially important but quite challenging. Here we present an experimentally feasible quantum algorithm assisted with continuous-variable for simulating quantum systems at…
A surrogate-based topology optimisation algorithm for linear elastic structures under parametric loads and boundary conditions is proposed. Instead of learning the parametric solution of the state (and adjoint) problems or the optimisation…
Surrogate models for computational simulations are input-output approximations that allow computationally intensive analyses, such as uncertainty propagation and inference, to be performed efficiently. When a simulation output does not…
Understanding the thermal behavior of additive manufacturing (AM) processes is crucial for enhancing the quality control and enabling customized process design. Most purely physics-based computational models suffer from intensive…
Reduced-order modelling and low-dimensional surrogate models generated using machine learning algorithms have been widely applied in high-dimensional dynamical systems to improve the algorithmic efficiency. In this paper, we develop a…
We propose an optimization algorithm to improve the design and performance of quantum communication networks. When physical architectures become too complex for analytical methods, numerical simulation becomes essential to study quantum…
Surrogate modeling has brought about a revolution in computation in the branches of science and engineering. Backed by Artificial Intelligence, a surrogate model can present highly accurate results with a significant reduction in…
Thermal aware routing and placement algorithms are important in industry. Currently, there are reasonably fast Green's function based algorithms that calculate the temperature distribution in a chip made from a stack of different materials.…
We present a modified simulated annealing method with a dynamical choice of the cooling temperature. The latter is determined via a closed-loop control and is proven to yield exponential decay of the entropy of the particle system. The…
In this work we explore surrogate models to optimize plasma enhanced atomic layer deposition (PEALD) in high aspect ratio features. In plasma-based processes such as PEALD and atomic layer etching, surface recombination can dominate the…