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In this study, we developed a UV-tape-assisted laser patterning (UT-Laser) technique that enables the simple transfer-based formation of wiring with line widths below 200 $\mu$m onto textile substrates. With the rapid advancement of…

Understanding the interplay between various design strategies (for instance, bonding heterogeneity and lone pair induced anharmonicity) to achieve ultralow lattice thermal conductivity ($\kappa_l$) is indispensable for discovering novel…

Acoustic tweezers comprising a surface acoustic wave chip and a disposable silicon microfluidic chip are potentially advantageous to stable and cost-ffective acoustofluidic experiments while avoiding the cross-contamination by reusing the…

Fluid Dynamics · Physics 2024-11-11 Shichao Jia , Soichiro Tsujino

Microwave sensors integrated with microfluidic platforms can provide the size and permittivity of single cells and microparticles. Amongst the microwave sensor topologies, the planar arrangement of electrodes is a popular choice owing to…

Trapped-ion quantum computing requires precise optical control for individual qubit manipulation. However, conventional free-space optics face challenges in alignment stability and scalability as the number of qubits increases. Integrated…

Reliable and consistent preparation of atom probe tomography (APT) specimens from aqueous and hydrated biological specimens remains a significant challenge. One particularly difficult process step is the use of a focused ion beam (FIB)…

Applied Physics · Physics 2023-09-01 Eric V. Woods , Se-Ho Kim , Ayman A. El-Zoka , Leigh T. Stephenson , Baptiste Gault

Traditional approaches to realize microwave tunability in microwire polymer composites which mainly rely on topological factors, magnetic field/stress stimuli, and hybridization prove to be burdensome and restricted to rather narrow band…

Materials Science · Physics 2019-06-27 A. Uddin , F. X. Qin , D. Estevez , S. D. Jiang , S. A. Jawed , L. V. Panina , H. X. Peng

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…

Other Computer Science · Computer Science 2008-12-18 Jürgen Wolf , P. Ramm , Armin Klumpp , H. Reichl

To enable low-power and low-complexity wireless monitoring, an improved circuit design of Analog Joint Source Channel Coding (AJSCC) is proposed for wireless sensor nodes. This innovative design is based on Analog Divider Blocks (ADB) with…

Signal Processing · Electrical Eng. & Systems 2019-07-03 Xueyuan Zhao , Vidyasagar Sadhu , Anthony Yang , Dario Pompili

Pairing-based cryptography (PBC) is crucial in modern cryptographic applications. With the rapid advancement of adversarial research and the growing diversity of application requirements, PBC accelerators need regular updates in algorithms,…

Hardware Architecture · Computer Science 2025-09-15 Tianwei Pan , Tianao Dai , Jianlei Yang , Hongbin Jing , Yang Su , Zeyu Hao , Xiaotao Jia , Chunming Hu , Weisheng Zhao

Bluetooth Low Energy (BLE) backscatter is a promising candidate for battery-free Internet of Things (IoT) applications. Unlike existing commodity-level BLE backscatter systems that only enable one-shot communication through BLE advertising…

Networking and Internet Architecture · Computer Science 2025-03-17 Huixin Dong , Yijie Wu , Feiyu Li , Wei Kuang , Yuan He , Qian Zhang , Wei Wang

Fabricating existing and popular open-source adaptive robotic grippers commonly involves using multiple professional machines, purchasing a wide range of parts, and tedious, time-consuming assembly processes. This poses a significant…

Robotics · Computer Science 2023-05-29 Xin Zhou , Adam J. Spiers

A location-aware multi-antenna coded caching scheme is proposed for applications with location-dependent data requests, such as wireless immersive experience, where users are immersed in a three-dimensional virtual world. The wireless…

Information Theory · Computer Science 2023-07-11 Hamidreza Bakhshzad Mahmoodi , MohammadJavad Salehi , Antti Tolli

Scan-based Design-for-Testability (DFT) measures are prevalent in modern digital integrated circuits to achieve high test quality at low hardware cost. With the advent of 3D heterogeneous integration and chiplet-based systems, the role of…

Hardware Architecture · Computer Science 2025-05-27 Sudipta Paria , Md Rezoan Ferdous , Aritra Dasgupta , Atri Chatterjee , Swarup Bhunia

Microfabrication using nano- to micron-sized building blocks holds great potential for applications in next-generation electronics, optoelectronics, and advanced materials. However, traditional methods like chemical vapor deposition and…

In the context of implantable bioelectronics, this work provides new insights into maximizing biomedical wireless power transfer (BWPT) via the systematic development of inductive links. This approach addresses the specific challenges of…

Signal Processing · Electrical Eng. & Systems 2025-03-20 Asif Iftekhar Omi , Anyu Jiang , Baibhab Chatterjee

During the second LHC long shutdown (LS2) the Inner Tracking System (ITS) of ALICE (A Large Ion Collider Experiment) will be replaced by seven layers of CMOS Monolithic Active Pixel Sensors (MAPS). The latest innovations in silicon imaging…

Nuclear Experiment · Physics 2020-05-01 D. Andreou

A simplified model of a metallic spin-type photonic topological insulator on a rhombic lattice is presented and analyzed. Instead of the more commonly used hexagonal unit cells, a reduced symmetry rhombus is employed, which is both simpler…

Mesoscale and Nanoscale Physics · Physics 2025-07-29 Robert J. Davis , Daniel F. Sievenpiper

We present an effective and fast (few microseconds) procedure for transferring ultra-cold atoms from the ground state in a harmonic trap into the desired bands of an optical lattice. Our shortcut method is a designed pulse sequence where…

Atomic Physics · Physics 2018-05-15 Xiaoji Zhou , Shengjie Jin , J. Schmiedmayer

With the development of quantum technology, hybrid devices that combine superconductors (S) and semiconductors (Sm) have attracted great attention due to the possibility of engineering structures that benefit from the integration of the…

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