Related papers: A Packaging Method for ALPIDE Integration Enabling…
Bump bonding is a superior assembly alternative compared to conventional wire bond techniques. It offers a highly reliable connection with greatly reduced parasitic properties. The Flip Chip on Board (FCOB) procedure is an especially…
The development of smart textile interfaces is hindered by the inclusion of rigid hardware components and batteries within the fabric, which pose challenges in terms of manufacturability, usability, and environmental concerns related to…
We present sample transfer instrumentation and integrated protocols for the preparation and correlative characterization of environmentally-sensitive materials by both atom probe tomography and electron microscopy. Ultra-high vacuum…
Four-wave mixing has extensively been investigated for various applications such as communications, spectroscopy, metrology, quantum computing and bio-imaging. However, there is a clear desire to implement these functionalities in a small…
Filter synthesis is an inverse problem that is traditionally approached rationally by considering spatially disjoint resonators, approximating them as lumped elements, and engineering the coupling of selected pairs. This approach strongly…
Superconducting flip-chip interconnects are crucial for the three-dimensional integration of superconducting circuits in sensing and quantum technology applications. We demonstrate a simplified approach for a superconducting flip-chip…
A new type of integrated polarizer based on bent coupled optical waveguides is proposed. The simplicity of the device geometry permits its realization using only basic standard fabrication steps. A deep etched waveguide silicon nitride…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
Photonic integrated circuits utilize various waveguide materials, each excelling in specific metrics like efficient light emission, low propagation loss, high electro-optic efficiency, and potential for mass production. Inherent…
Accurate shape sensing, only achievable through distributed proprioception, is a key requirement for closed-loop control of soft robots. Low-cost power efficient optoelectronic sensors manufactured from flexible materials represent a…
In the past decade, lithium niobate (LiNbO3 or LN) photonics, thanks to its heat-free and fast electro-optical modulation, second-order non-linearities and low loss, has been extensively investigated. Despite numerous demonstrations of…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
Dense and efficient circuits with component sizes approaching the physical limit is the hallmark of high performance integration. However, current fabrication technology is mostly constraint to 2D lithography, and thermal energy dissipation…
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although reliable, remain costly and difficult to implement for…
Hybrid analog-digital (A/D) transceivers designed for millimeter wave (mmWave) systems have received substantial research attention, as a benefit of their lower cost and modest energy consumption compared to their fully-digital…
This paper presents a novel design for a compact, lightweight 6-axis force/torque sensor intended for use in legged robots. The design promotes easy manufacturing and cost reduction, while introducing innovative calibration methods that…
Application Specific Integrated Circuits (ASICs) are used in space-borne instruments for signal processing and detector readout. The electrical interface of these ASICs to frontend printed circuit boards (PCBs) is commonly accomplished with…
Recently, a novel flexible-antenna technology, called pinching antennas, has attracted growing academic interest. By inserting discrete dielectric materials, pinching antennas can be activated at arbitrary points along waveguides, allowing…
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out…
We have designed and tested a robust 20 $\times$ 20 cm$^2$ thin metal film internal anode capacitively coupled to an external array of signal pads or micro-strips for use in fast microchannel plate photodetectors. The internal anode, in…