Related papers: A Packaging Method for ALPIDE Integration Enabling…
The ALICE Inner Tracking System has been recently upgraded to a full silicon detector consisting entirely of MAPS, arranged in seven concentric layers around the LHC beam pipe. Further ahead, during the LHC Long Shutdown 3, the ALICE…
We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a…
Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained…
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…
The upgrade of the Inner Tracking System (ITS) of ALICE (A Large Ion Collider Experiment) will extend measurements of heavy-flavour hadrons and low-mass dileptons to a lower transverse momentum than currently achieved and increase the…
We present an approach to fabrication and packaging of integrated photonic devices that utilizes waveguide and detector layers deposited at near-ambient temperature. All lithography is performed with a 365 nm i-line stepper, facilitating…
Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical…
The Inner Tracking System (ITS) of the ALICE experiment will be upgraded during the second long LHC shutdown in $\mathrm{2019}-\mathrm{2020}$. The main goal of the ALICE ITS Upgrade is to enable high precision measurements of low - momentum…
The MALTA CMOS monolithic silicon pixel sensors has been developed in the Tower 180 nm CMOS imaging process. It includes an asynchronous readout scheme and complies with the ATLAS inner tracker requirements for the HL-LHC. Several 4-chip…
Application Specific Integrated Circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space qualified technique of making interconnections between ASICs and their…
We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 $\mu$m thick, produced at VTT…
Advancements in miniaturisation and new capabilities of implantable devices impose a need for the development of compact, hermetic, and CMOS-compatible micro packaging methods. Gold-tin-based eutectic bonding presents the potential for…
Photonic Integrated Circuits (PICs) offer transformative potential for computing systems, enabling high-bandwidth neuromorphic processors and facilitating low decoherence quantum computing on a chip scale platform. However, the development…
Bent monolithic active pixel sensors are the basis for the planned fully cylindrical ultra low material budget tracking detector ITS3 of the ALICE experiment. This paper presents results from testbeam campaigns using high-energy particles…
We report a device fabrication strategy of making multi-terminal electrical contacts on small (< 1 mm) bulk quantum materials using lithography-based techniques for electrical transport studies. The crystals are embedded in a polymeric…
The Inner Tracking System (ITS) of the ALICE experiment at the CERN Large Hadron Collider (LHC) is the largest Monolithic Active Pixel Sensor technology application in high-energy physics. The upgraded version of the tracking system, called…
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous systems typically prioritizes wirelength reduction through tight…
The R&D activity presented is focused on the development of new modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The performance after irradiation of n-in-p pixel sensors of different active thicknesses…
We demonstrate adiabatically tapered fibers terminating in sub-micron tips that are clad with a higher-index material for coupling to an on-chip waveguide. This cladding enables coupling to a high-index waveguide without losing light to the…
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R\&D phase, especially for small-scale applications, such…