Related papers: Microassembly of Multi-Material and 3D Integration…
Neuromorphic computing based on spiking neural networks has the potential to significantly improve on-line learning capabilities and energy efficiency of artificial intelligence, specially for edge computing. Recent progress in…
Future quantum technology relies crucially on building quantum networks with high fidelity. To achieve this challenging goal, it is of utmost importance to connect single quantum systems in a way such that their emitted single-photons…
This work demonstrates a large area process for atomically thin 2D semiconductors to unlock the technological upscale required for their commercial uptake. The new atomic layer deposition (ALD) and conversion technique yields large area…
Two-dimensional (2D) bismuth oxyselenide (Bi2O2Se) with high electron mobility is advantageous in future high-performance and flexible electronic and optoelectronic devices. However, transfer of thin Bi2O2Se flakes is rather challenging,…
Current techniques of patterned material deposition require separate steps for patterning and material deposition. The complexity and harsh working conditions post serious limitations for fabrication. Here, we introduce a novel single-step…
The hallmark feature of polymorphic systems is their ability to assemble into many possible structures at the same thermodynamic state. Designer polymorphic materials can in principle be engineered via programmable self-assembly, but the…
In this paper we present the theoretical considerations and the design evolution of a proof-of-concept reconfigurable metasurface, primarily used as a tunable microwave absorber, but also as a wavefront manipulation and polarization…
The thermal deposition and transfer Printing method had been used to produce pentacene thin-films on SiO2/Si and plastic substrates (PMMA and PVP), respectively. X-ray diffraction patterns of pentacene thin films showed reflections…
3D-printed digital materials whose mechanical behavior travels between those from thermoplastic to rubbery polymers have become increasingly important. However, their mechanical functionalities have not been fully exploited due to intrinsic…
In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the dual-sided Monolithic 3D (M3D). Based on…
We present a novel platform of optical tweezers which combines rapid prototyping of user-definable microlens arrays with spatial light modulation (SLM) for dynamical control of each associated tweezer spot. Applying femtosecond direct laser…
Microfluidic chips provide unparalleled control over droplets and jets, which have advanced all natural sciences. However, microfluidic applications could be vastly expanded by increasing the per-channel throughput and directly exploiting…
In this study, we developed a UV-tape-assisted laser patterning (UT-Laser) technique that enables the simple transfer-based formation of wiring with line widths below 200 $\mu$m onto textile substrates. With the rapid advancement of…
Solid-state micro/nanopores play an important role in the sensing field because of their high stability and controllable size. Aiming at problems of complex processes and high costs in pore manufacturing, we propose a convenient and…
This article introduces an experimental emulation of a novel chunk-based flexible multi-DoF aerial 3D printing framework. The experimental demonstration of the overall autonomy focuses on precise motion planning and task allocation for a…
Modern microelectronic processors have migrated towards parallel computing architectures with many-core processors. However, such expansion comes with diminishing returns exacted by the high cost of data movement between individual…
Dielectrophoresis is an electric field-based technique for moving neutral particles through a fluid. When used for particle separation, dielectrophoresis has many advantages compared to other methods, providing label-free operation with…
Controlled integration of metallic nanoparticles (NPs) onto photonic nanostructures enables realization of complex devices for extreme light confinement and enhanced light-matter interaction. This can be achieved combining…
Machines enabled the Industrial Revolution and are central to modern technological progress: A machine's parts transmit forces, motion, and energy to one another in a predetermined manner. Today's engineering frontier, building artificial…
3D additive manufacturing enables the fabrication of nanophotonic structures with subwavelength features that control light across macroscopic scales. Gradient-based optimization offers an efficient approach to design these complex and…