Related papers: Microassembly of Multi-Material and 3D Integration…
We present a design approach for realizing on-chip wavelength division demultiplexing (WDD) schemes by integrating all-dielectric metasurfaces of TiO2 nanorod arrays into a SiN waveguide. The designed metasurface locally modifies the…
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic…
The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems. This requires fully exploiting the inherent parallelism of…
Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicates device fabrication and limits their potential applications. Here, we present a universal…
A home-built compact system that functions as both a transfer stage for deterministic transfer processes and a mask aligner for contact photolithography, is constructed. The precision translation sample stage and optical microscope are…
Additive manufacturing strives to combine any combination of materials into three dimensional functional structures and devices, ultimately opening up the possibility of 3D printed machines. It remains difficult to actuate such devices,…
3D printing mechanically flexible composite materials with high electrical conductivity is currently hindered by the need to use high loading of conductive filler, which severely limits flexibility. Here, microstructural patterning of…
We present the design, fabrication, and experimental characterization of a two-dimensional, dynamically tuned, metasurface aperture, emphasizing its potential performance in computational imaging applications. The dynamic metasurface…
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also…
3D printing has enabled various applications using different forms of materials, such as filaments, sheets, and inks. Typically, during 3D printing, feedstocks are transformed into discrete building blocks and placed or deposited in a…
Physical input devices serve as a tactile interface between users and computing systems. These devices are often complex assemblies that consist of both electrical and mechanical components making customization difficult and out of reach…
Radiative heat transfer is of great interest from a fundamental point of view and for energy harvesting applications. This is a material dependent phenomenon where confined plasmonic excitations, hyperbolicity and other properties can be…
Here, we propose an easy and robust strategy for the versatile preparation of hybrid plasmonic nanopores by means of controlled deposition of single flakes of MoS2 directly on top of metallic holes. The device is realized on silicon nitride…
In superconductivity, electrons exhibit unique macroscopic collective quantum behavior that is the key for many modern quantum technologies. This electron behavior stems vastly from coupling to a correlated motion of atoms in the material,…
This paper presents innovative designs for 3D-printed tumbling microrobots, specifically engineered for targeted in vivo drug delivery applications. The microrobot designs, created using stereolithography 3D printing technologies,…
Freeform thin-shell surfaces are critical in various fields, but their fabrication is complex and costly. Traditional methods are wasteful and require custom molds, while 3D printing needs extensive support structures and post-processing.…
Flexible transparent electrodes, encompassing the combination of optical transparency and electrical conductivity, empower numerous optoelectronic applications. While the main efforts nowadays concentrate on developing wire meshes and…
Carbon Nanotubes (CNTs)-polymer composites are promising candidates for a myriad of applications. Ad-hoc CNTs-polymer composite fabrication techniques inherently pose roadblock to optimized processing resulting in microstructural defects…
Printed electronics is quickly emerging with tremendous value in a wide variety of latest electrical engineering areas. However, restricted to the rather limited conductive inks and printing strategies, the currently existing electronics…
The polymer nanocomposites find applications in diverse areas ranging from smart materials to bioengineering. They are developed by dispersion of nanomaterials in a bulk phase of a polymeric material. Although several methods facilitate…