Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicates device fabrication and limits their potential applications. Here, we present a universal submicron fabrication method for mesoscopic devices using a dry-transfer technique, tailored specifically for sensitive materials. This approach utilizes PMMA masks, combined with a water-dissoluble coating as a sacrificial layer, to ensure that sensitive materials are processed without exposure to harmful environmental conditions. The entire fabrication process is carried out in a glove box, employing dry techniques that avoid air, solvents, and heat exposure, culminating in an encapsulation step. We demonstrate the utility of this method by fabricating and characterizing K2Cr3As3 and WTe2 devices, a one- and two-dimensional material, respectively. The results show that our technique preserves the integrity of the materials, provides excellent contact interfaces, and is broadly applicable to a range of sensitive materials.
@article{arxiv.2508.19550,
title = {A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials},
author = {Zhongmou Jia and Yiwen Ma and Zhongchen Xu and Xue Yang and Jianfei Xiao and Jiezhong He and Yunteng Shi and Zhiyuan Zhang and Duolin Wang and Sicheng Zhou and Bingbing Tong and Peiling Li and Ziwei Dou and Xiaohui Song and Guangtong Liu and Jie Shen and Zhaozheng Lyu and Youguo Shi and Jiangping Hu and Li Lu and Fanming Qu},
journal= {arXiv preprint arXiv:2508.19550},
year = {2025}
}