Related papers: Microassembly of Multi-Material and 3D Integration…
Advances in 3D printing technology now enable the precise positioning of microscopic material voxels to form complex structures. Combined with emerging multi-material capabilities and printable responsive materials, this opens new…
Self-assembled nano and micro-structures, particularly those capable of responsive erasure and regeneration, have garnered significant interest for their applications in smart photonics and electronics. However, current techniques for…
Precision and chip contamination-free placement of two-dimensional (2D) materials is expected to accelerate both the study of fundamental properties and novel device functionality. Current transfer methods of 2D materials onto an arbitrary…
Two-dimensional (2D) materials with extraordinary electrical properties, hold promising for large-scale, flexible electronics. However, their device performance could be hindered due to the excessive defects introduced via traditional…
Meeting the escalating demands of data transmission and computing, driven by artificial intelligence (AI), requires not only faster optical transceivers but also advanced integration technologies that can seamlessly combine photonic and…
Open source hardware has the potential to revolutionise the way we build scientific instruments; with the advent of readily-available 3D printers, mechanical designs can now be shared, improved and replicated faster and more easily than…
Applications such as augmented and virtual reality (AR/VR), optical atomic clocks, and quantum computing require photonic integration of (near-)visible laser sources to enable commercialization at scale. The heterogeneous integration of…
Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip…
Integrated micro-nanochannel networks in fluidic devices are desirable in a number of applications ranging from self-healing/cooling materials to bioengineering. The conventional micro-manufacturing techniques are capable of either…
4D printing empowers 3D printed structures made of hydrogels, liquid crystals or shape memory polymers, with reversible morphing capabilities in response to an external stimulus. To apply reversible shape-change to stiff lightweight…
High-speed Pockels modulation and second-order nonlinearities are key components in optical systems, but CMOS-compatible platforms like silicon and silicon nitride lack these capabilities. Micro-transfer printing of thin-film lithium…
2D materials and their monolayers have attracted widespread interest by virtue of their unique electronic and optical properties. In addition to their remarkable physical characteristics, their atomically thin nature enables their…
The combination of metasurfaces with chalcogenide phase-change materials is a highly promising route towards the development of multifunctional and reconfigurable nanophotonic devices. However, their transition into real-world devices is…
Polymer 3D printing is a broad set of manufacturing methods that permit the fabrication of complex architectures, and, as a result, numerous efforts focus on formulating processible chemistries that produce desirable material behavior in…
We have designed and prototyped the process steps for the batch production of large-area micro-channel-plate photomultipliers (MCP-PMT) using the "air-transfer" assembly process developed with single $LAPPD^{\text{TM}}$ modules. Results are…
Dynamic stencil deposition (DSD) techniques offer a variety of fabrication advantages not possible with traditional lithographic processing, such as the the ability to directly deposit nanostructures with programmable height profiles.…
3D printing enables the fabrication of complex architectures by automating long sequences of additive steps. The increasing sophistication of printers, materials, and generative design promises to make geometric complexity a non-issue in…
The emerging new paradigm of technologies, the internet of things, entails a process of device miniaturization to combine several functional components, such as sensors, actuators, and powering elements, in a single individual on-chip…
A reliable and scalable transfer of 2D-TMDCs (two-dimensional transition metal dichalcogenides) from the growth substrate to a target substrate with high reproducibility and yield is a crucial step for device integration. In this work, we…
A printing process for high-resolution transfer of all components for organic electronic devices on plastic substrates has been developed and demonstrated for pentacene (Pn), poly (3-hexylthiophene) and carbon nanotube (CNT) thin-film…