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3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are…

High-resolution 3D tracking with sub-nanosecond timing is required for the detection of elementary particles, such as neutrinos. Conventional detectors, which utilize analog silicon photomultipliers, face challenges in balancing spatial…

Future experiments at hadron colliders require an evolution of the tracking sensors to ensure sufficient radiation hardness as well as space and time resolution to handle unprecedented particle fluxes. 3D diamond sensors with…

We report on the characterization by a position resolved laser system of small-pitch 3D diodes irradiated with neutrons up to an extremely high fluence of 3.5x10**16 neq cm**-2. We show that very high values of signal efficiency are…

In this paper we present a complete characterization of the first batch of Resistive AC-Coupled Silicon Detectors, called RSD1, designed at INFN Torino and manufactured by Fondazione Bruno Kessler (FBK) in Trento. With their 100%…

Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughput and yield, as well as low cost. The pixel sensors are…

Two design innovations, low-gain avalanche (Low-Gain Avalance Diode, LGAD) and resistive read-out (Resistive Silicon Detector, RSD), have brought strong performance improvements to silicon sensors. Large signals, due to the added gain…

In the past few years, the need of measuring accurately the spatial and temporal coordinates of the particles generated in high-energy physics experiments has spurred a strong R\&D in the field of silicon sensors. Within these research…

To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active edge technology allows to reduce the…

The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A…

CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher…

4-dimensional (4D) trackers with ultra fast timing (10-30 ps) and very fine spatial resolution (O(few $\mu$m)) represent a new avenue in the development of silicon trackers, enabling new physics capabilities beyond the reach of the existing…

The pixel detector is the innermost tracking device in CMS, reconstructing interaction vertices and charged particle trajectories. The sensors located in the innermost layers of the pixel detector must be upgraded for the ten-fold increase…

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel…

The potential of photon detectors to achieve precise timing information is of increasing importance in many domains, PET and CT scanners in medical imaging and particle physics detectors, amongst others. The goal to increase by an order of…

The foreseen luminosity upgrade for the LHC (a factor of 5-10 more in peak luminosity by 2021) poses serious constraints on the technology for the ATLAS tracker in this High Luminosity era (HL-LHC). In fact, such luminosity increase leads…

Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to…

We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully…

With the High-Luminosity Large Hadron Collider (HL-LHC) the number of collisions per bunch crossing increases. To cope with these high rates in the pixel trackers, per-pixel time measurements are required, which implies the need for fast…

State-of-the-art time-of-flight (ToF) based 3D sensors suffer from poor lateral and depth resolutions. In this work, we introduce a novel sensor concept that provides ToF-based 3D measurements of real world objects with depth precisions up…