We describe technologies which can be developed to produce large area, low cost pixelated tracking detec- tors. These utilize wafer-scale 3D electronics and sensor technologies currently being developed in industry. This can result in fully active sensor/readout chip tiles which can be assembled into large area arrays with good yield and minimal dead area. The ability to connect though the bulk of the device can also provide better electrical performance and lower mass.
@article{arxiv.1307.4301,
title = {3D Technologies for Large Area Trackers},
author = {G. Deptuch and U. Heintz and M. Johnson and C. Kenney and R. Lipton and M. Narian and S. Parker and A. Shenai and L. Spiegel and J. Thom and Z. Ye},
journal= {arXiv preprint arXiv:1307.4301},
year = {2013}
}
Comments
Whitepaper submitted to the Snowmass Instrumentation Frontier