Related papers: DiffChip: Thermally Aware Chip Placement with Auto…
In recent years, the growing demand to process large graphs and sparse datasets has led to increased research efforts to develop hardware- and software-based architectural solutions to accelerate them. While some of these approaches achieve…
Considering that the physical design of printed circuit board (PCB) follows the principle of modularized design, this paper proposes an automatic placement algorithm for functional modules. We first model the placement problem as a…
2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects (ICIs). As the number of chiplets…
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain multiple materials with non-linear heat transfer properties…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
A novel approach to calibrate the sensitivity of a differential thermometer, consisting of several thermocouples connected in series (thermopile), has been developed. The goal of this method is to increase the accuracy of small temperature…
Our study introduces a Generative AI method that employs a cooling-guided diffusion model to optimize the layout of battery cells, a crucial step for enhancing the cooling performance and efficiency of battery thermal management systems.…
Recent advances in diffusion transformers (DiTs) have set new standards in image generation, yet remain impractical for on-device deployment due to their high computational and memory costs. In this work, we present an efficient DiT…
Optimizing shapes and topology of physical devices is crucial for both scientific and technological advancements, given its wide-ranging implications across numerous industries and research areas. Innovations in shape and topology…
A chiplet is an integrated circuit that encompasses a well-defined subset of an overall system's functionality. In contrast to traditional monolithic system-on-chips (SoCs), chiplet-based architecture can reduce costs and increase…
Analog circuit design consists of the pre-layout and layout phases. Among them, the pre-layout phase directly decides the final circuit performance, but heavily depends on experienced engineers to do manual design according to specific…
This paper addresses the challenges of thermal sensor allocation and full-chip temperature reconstruction in multi-core systems by leveraging an entropy-based sensor placement strategy and an adaptive compressive sensing approach. By…
Temperature affects not only the reliability but also the performance, power, and cost of the embedded system. This paper proposes a thermal-aware task allocation and scheduling algorithm for embedded systems. The algorithm is used as a…
As persistent memory (PM) technologies emerge, hybrid memory architectures combining DRAM with PM bring the potential to provide a tiered, byte-addressable main memory of unprecedented capacity. Nearly a decade after the first proposals for…
Accurate knowledge of temperatures in power semiconductor modules is crucial for proper thermal management of such devices. Precise prediction of temperatures allows to operate the system at the physical limit of the device avoiding…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
With the increasing prevalence of chiplet systems in high-performance computing applications, the number of design options has increased dramatically. Instead of chips defaulting to a single die design, now there are options for 2.5D and 3D…
Thermal analysis is increasingly critical in modern integrated circuits, where non-uniform power dissipation and high transistor densities can cause rapid temperature spikes and reliability concerns. Traditional methods, such as FEM-based…
This paper focuses on the simulation of multi-die System-on-Chip (SoC) architectures using VisualSim, emphasizing chiplet-based system modeling and performance analysis. Chiplet technology presents a promising alternative to traditional…
Macro placement is a vital step in digital circuit design that defines the physical location of large collections of components, known as macros, on a 2D chip. Because key performance metrics of the chip are determined by the placement,…