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The apparatus of the ALICE experiment at CERN will be upgraded in 2017/18 during the second long shutdown of the LHC (LS2). A major motivation for this upgrade is to extend the physics reach for charmed and beauty particles down to low…
MIMOSIS is a CMOS Monolithic Active Pixel Sensor developed to equip the Micro Vertex Detector of the Compressed Baryonic Matter (CBM) experiment at FAIR/GSI. The sensor will combine an excellent spatial precision of $5~\mu m$ with a time…
Monolithic CMOS pixel detectors have emerged as competitive contenders in the field of high-energy particle physics detectors. By utilizing commercial processes they offer high-volume production of such detectors. A series of prototypes has…
The next-generation ALICE 3 experiment at the High-Luminosity LHC (HL-LHC) requires detector technologies that combine fine spatial resolution, fast timing, and an extremely low material budget. This paper presents the design,…
Various chips for the silicon sensors measurements are described. These chips are based on 0.35 um and 0.18um CMOS technology. Several analog chips together with self-trigger /derandomizer one allow to measure silicon sensors designed for…
After the Large Hadron Collider (LHC) upgrade into High Luminosity LHC (HL-LHC), the instantaneous luminosity is expected to reach values up to 7.5x10^34cm^2/s, causing a harsher radiation environment as well as a significant increase in…
To cope with the higher occupancy and radiation damage at the HL-LHC also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project (PPS) is an international collaboration of 17 institutions and more than 80…
In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the Inner Detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation…
During the long shutdown (LS) 3 beginning 2022 the LHC will be upgraded for higher luminosities pushing the limits especially for the inner tracking detectors of the LHC experiments. In order to cope with the increased particle rate and…
The ATLAS Semiconductor Tracker (SCT) together with the pixel and the transition radiation detectors will form the tracking system of the ATLAS experiment at LHC. It will consist of 20000 single-sided silicon microstrip sensors assembled…
Silicon pixel sensors manufactured using commercial CMOS processes are promising instruments for high-energy particle physics experiments due to their high yield and proven radiation hardness. As one of the essential factors for the…
The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to…
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) requires new high-radiation tolerant silicon pixel sensors for the innermost part of the tracking detector in the CMS experiment. The innermost layer of the tracker,…
Monolithic Active Pixel Sensors (MAPS) combine the sensing part and the front-end electronics in the same silicon layer, making use of CMOS technology. Profiting from the progresses of this commercial process, MAPS have been undergoing…
Silicon pixel detectors produced according to the ATLAS Pixel Detector design were tested in a beam at CERN in the framework of the ATLAS collaboration. The detectors used n+/n sensors with oxygenated silicon substrates. The experimental…
MiniCACTUS is a monolithic sensor prototype optimised for timing measurement of charged particles. It has been designed in a standard 150 nm CMOS process without dedicated amplification layer. It is intended as a demonstrator chip for…
CMOS sensors were successfully implemented in the STAR tracker [1]. LHC experiments have shown that efficient b tagging, reconstruction of displaced vertices and identification of disappearing tracks are necessary. An improved vertex…
The H2M (Hybrid-to-Monolithic) is a monolithic pixel sensor manufactured in a modified \SI{65}{\nano\meter}~CMOS imaging process with a small collection electrode. Its design addresses the challenges of porting an existing hybrid pixel…
Small-pitch 3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC pixel detector upgrades. Prototype 3D sensors with pixel sizes of 50$\times$50 and 25$\times$100 $\mu$m$^{2}$…
We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 $\mathrm{\mu}$m, produced at MPP/HLL, and 100-200 $\mathrm{\mu}$m thin active edge sensor devices,…