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Rapid growth in artificial intelligence (AI) workloads is driving up data center power densities, increasing the need for advanced thermal management. Direct-to-chip liquid cooling can remove heat efficiently at the source, but many cold…
A framework for topology optimization of cooling channels is proposed, which paves the way towards automated design of additively-manufactured cooling channels, required in applications such as the efficient heat management of die casting…
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Blackwell Superchip. In this work, a physics-based…
With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat…
Design of effective micro cooling systems to address the challenges of ever increasing heat flux from microdevices requires deep examination of real time problems and has been tackled in depth. The most common and apparently misleading…
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to…
Data centers handle impressive high figures in terms of energy consumption, and the growing popularity of Cloud applications is intensifying their computational demand. Moreover, the cooling needed to keep the servers within reliable…
The AI datacenters are currently being deployed on a large scale to support the training and deployment of power-intensive large-language models (LLMs). Extensive amount of computation and cooling required in datacenters increase concerns…
Efficient thermal management in high-power electronic devices requires cooling channel designs that provide high heat removal while satisfying strict spatial and manufacturing constraints. This study presents a two-stage hierarchical…
As modern electronic devices are increasingly miniaturized and integrated, their performance relies more heavily on effective thermal management. Two-phase cooling methods enhanced by porous surfaces, which capitalize on thin-film…
Mitigation of hot spots in MEMS employing in situ microchannel systems requires a comprehensive picture of the maldistribution of the working fluid and uniformity of cooling within the same. In this article, detailed simulations employing…
Analyzing data centers with thermal-aware optimization techniques is a viable approach to reduce energy consumption of data centers. By taking into account thermal consequences of job placements among the servers of a data center, it is…
The demand for high-performance heat sinks has significantly increased with advancements in computing power and the miniaturization of electronic devices. Among the promising solutions, nanofluids have attracted considerable attention due…
Cooling high-power electronics in multilayer integrated circuits (ICs) is challenging for existing cooling methods. In this work, we designed through-chip microchannels (TCMCs) that cross the entire chip perpendicularly to the layers, with…
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis…
Virtual Data Center (VDC) embedding has drawn significant attention recently because of growing need for efficient and flexible means of Data Center (DC) resource allocation. Existing studies on VDC embedding mainly focus on improving DCs'…
In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The…
The race towards performance increase and computing power has led to chips with heterogeneous and complex designs, integrating an ever-growing number of cores on the same monolithic chip or chiplet silicon die. Higher integration density,…
We present a massively parallel solver that accelerates DC loadflow computations for power grid topology optimization tasks. Our approach leverages low-rank updates of the Power Transfer Distribution Factors (PTDFs) to represent substation…
With the current high levels of energy consumption of data centers, reducing power consumption by even a small percentage is beneficial. We propose a framework for thermal-aware workload distribution in a data center to reduce cooling power…