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Chiplets are modular integrated circuits that can be combined to form a larger system, offering flexibility and performance enhancements. However, their dense packing often leads to significant thermal management challenges, requiring…
Graphics processing units (GPU) had evolved from a specialized hardware capable to render high quality graphics in games to a commodity hardware for effective processing blocks of data in a parallel schema. This evolution is particularly…
AI data-center expansion is increasingly constrained by the coupled availability of deliverable electricity and heat-rejection (cooling) capacity. We propose and evaluate an integrated Waste-to-Energy-AI Data Center configuration that…
CPU-GPU heterogeneous architectures are now commonly used in a wide variety of computing systems from mobile devices to supercomputers. Maximizing the throughput for multi-programmed workloads on such systems is indispensable as one single…
GPUs are now used for a wide range of problems within HPC. However, making efficient use of the computational power available with multiple GPUs is challenging. The main challenges in achieving good performance are memory layout, affecting…
Direct laser slab face-cooling by a fluid crossing the main and pump laser beams is an important method to reach high average laser powers. However, the flow regime is usually maintained at low Reynolds numbers, to prevent the onset of…
Edge computing has emerged as a pivotal technology, offering significant advantages such as low latency, enhanced data security, and reduced reliance on centralized cloud infrastructure. These benefits are crucial for applications requiring…
High temperatures have dramatic negative effects on interconnect performance and, hence, numerous techniques have been proposed to reduce the power consumption of on-chip buses. However, existing methods fall short of fully addressing the…
The increasing power densities and intricate heat dissipation paths in advanced 2.5D/3D chiplet systems necessitate thermal modeling frameworks that deliver detailed thermal maps with high computational efficiency. Traditional compact…
With technology scaling down, hundreds and thousands processing elements (PEs) can be integrated on a single chip. Network-on-chip (NoC) has been proposed as an efficient solution to handle this distinctive challenge. In this thesis, we…
The revolution in artificial intelligence (AI) brings up an enormous storage and data processing requirement. Large power consumption and hardware overhead have become the main challenges for building next-generation AI hardware. To…
High Performance and Energy Efficiency are critical requirements for Internet of Things (IoT) end-nodes. Exploiting tightly-coupled clusters of programmable processors (CMPs) has recently emerged as a suitable solution to address this…
Thermally coupled distillation is a new energy-saving method, but the traditional thermally coupled distillation simulation calculation process is complicated, and the optimization method based on the traditional simulation process is…
With heterogeneous systems, the number of GPUs per chip increases to provide computational capabilities for solving science at a nanoscopic scale. However, low utilization for single GPUs defies the need to invest more money for expensive…
We present a B\'ezier-based Multi-Fidelity Thermal Optimization Framework, which is a computationally efficient methodology for the global optimization of 3D heat sinks. The flexible B\'ezier-parameterized fin geometries and the adopted…
Data-hungry applications that require terabytes of memory have become widespread in recent years. To meet the memory needs of these applications, data centers are embracing tiered memory architectures with near and far memory tiers.…
We study the factors affecting training time in multi-device deep learning systems. Given a specification of a convolutional neural network, our goal is to minimize the time to train this model on a cluster of commodity CPUs and GPUs. We…
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor…
The quest to identify the best heat engine has been at the center of science and technology. Thermoelectric nanoscale heat engines convert heat flows into useful work in the form of electrical power and promise the realization of on-chip…
We model a microchannel cooling system and consider the optimization of its shape by means of shape calculus. A three-dimensional model covering all relevant physical effects and three reduced models are introduced. The latter are derived…