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Micro-transfer printing is an assembly technology that enables large-scale integration of diverse materials and components from micro- to nano-scale. However, traditional micro-transfer printing technologies lack dynamic selectivity,…
The advent of additive manufacturing has opened opportunities to rapidly prototype devices and products ranging from automotive and aerospace applications to micro/nanoscale metastructures, as examples). Three-dimensional (3D) printing has…
Photonic integrated circuits (PICs) directly written with a femtosecond laser have shown great potential in many areas such as quantum information processing (QIP). Many applications, like photon-based quantum computing, demand the…
Photonic integration on plastic substrates enables emerging applications ranging from flexible interconnects to conformal sensors on biological tissues. Such devices are traditionally fabricated using pattern transfer, which is complicated…
We present an infrared photodetector leveraging an all-epitaxial device architecture consisting of a 'designer' plasmonic metal integrated with a quantum-engineered detector structure, all in a mature III-V semiconductor material system.…
Three-dimensional electron diffraction (3DED) is a powerful technique providing for crystal structure solutions of sub-micron sized crystals too small for structure determination via X-ray techniques. The entry requirement, however, of a…
Metallic nanostructures provide a toolkit for the generation of coherent light below the diffraction limit. Plasmonic based lasing relies on the population inversion of emitters (such as organic fluorophores) along with feedback provided by…
Novel technologies and new materials are in high demand for future energy-efficient electronic devices to overcome the fundamental limitations of miniaturization of current silicon-based devices. Two-dimensional (2D) materials show…
This work presents the design, simulation, fabrication, and characterization of a novel architectural compact two-dimensional (2D) resonant MEMS scanning mirror actuated by thin-film lead zirconate titanate (PZT). The device employs an…
We present SPIKE (Spectrometry Processing Innovative KErnel), an open-source Python package dedicated to Fourier spectroscopies. It provides basic functionalities such as apodisation, a complete set of Fourier transforms, phasing for NMR),…
We present PileUp, a tufted pile e-textile sensing approach that offers unique affordances through the tactile expressiveness and richness of its continuous, threaded-volume construction. By integrating conductive yarns in looped or cut…
Using aerogel as radiator and multianode PMTs for photon detection, a proximity focusing Cherenkov ring imaging detector has been constructed and tested in the KEK $\pi$2 beam. The aim is to experimentally study the basic parameters such as…
Despite advances in soft, sticker_like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco friendly conductive ink for thin_film circuitry composed of silver flakes and a…
A new flash (ultra-rapid) spark plasma sintering method applicable to various materials systems, regardless of their electrical resistivity, is developed. A number of powders ranging from metals to electrically insulative ceramics have been…
Development of advanced optical data storage, information encryption, and security labeling technologies requires low-cost materials exhibiting local, pronounced, and diverse modification of their structure-dependent optical properties…
Since the discovery of graphene, its excellent physical properties has greatly improved the performance of many optoelectronic devices and brought important technological revolution to optical research and application. Here, we introduce…
Metal-halide perovskites (MHPs) have exciting optoelectronic properties and are under investigation for various applications, such as photovoltaics, light-emitting diodes, and lasers. An essential step towards exploiting the full potential…
Field-induced self-organized patterning in ultrathin (< 100 nm) polymer films produces resolutions of the order of 10 {\mu}m or more because of the high energy penalty for the surface deformations on small scales. We propose here a very…
Heat pipe is one of the most efficient tools for heat dissipation in electronics and power systems. Currently, heat pipes are usually made of copper, aluminum or stainless steel. Due to their relatively high density and limited heat…
4D printing is a new manufacturing paradigm that combines stimuli-responsive materials, mathematics, and multi-material additive manufacturing to yield encoded multi-material structures with intelligent behavior over time. This emerging…